New technology enabling additional heat dissipation through the top of the package
DC-DC applications such as power modules, communication equipment, and servers are increasingly constrained by space
As they receive this, designers are looking for smaller-sized components, and the thermal properties of these components
Characteristics are becoming an important consideration.

To meet the demand for higher current characteristics, efficiency, and smaller packages, Fairchild Semiconductor has developed the Dual Cool™ package for MOSFETs. The Dual Cool™ package is a new PQFN package that incorporates new technology enabling additional heat dissipation through the top of the package.

Dual Cool™ packaging features an exposed thermal pad that minimizes thermal resistance from the silicon to the top of the case, providing 60% higher power dissipation capability than standard PQFN packages when an external heat sink is attached. Additionally, the MOSFETs inside the Dual Cool package are designed using Fairchild’s proprietary PowerTrench® process, which enables lower RDS(ON) and higher load current within a smaller package.

Unlike competitors' top-side thermal solutions, these components are currently available in Power33 (3.3mm x 3.3mm) and Power56 (5mm x 6mm) Dual Cool packages. Dual Cool™ enables power management designers to rapidly verify Dual Cool package MOSFET products that increase thermal efficiency while allowing them to use the industry's standard PQFN footprint without the need to conform to non-standard package specifications.

Products currently available as Dual Cool packages include FDMS2504SDC, FDMS2506SDC, FDMS2508SDC, FDMS2510SDC (5mm x 6mm footprint) and FDMC7660DC (3.3mm x 3.3mm footprint). These products are DC-DC converters, communication secondary rectifiers, and high-performance servers and workstays