Targeting the IoT market as well, Samsung begins mass production of Exynos APs with integrated connectivity.
Published2016.08.30 11:4470% improvement in performance and 30% improvement in power efficiency compared to the previous generation 28nm product
Samsung Electronics announced that it has started mass production of the 'Exynos 7570,' a low-cost mobile AP that integrates modem and connectivity functions based on the industry's first high-performance, low-power 14nm FinFET process.
Samsung Electronics is solidifying its leadership in advanced process technology by mass-producing premium mobile APs based on the 14nm process for the first time in the industry last year and applying the 14nm process to entry-level products early this year.
With the launch of the new low-cost product 'Exynos 7570' in mass production, Samsung Electronics has further expanded its 14nm-based entry-level mobile AP lineup and created an opportunity to provide high-performance/low-power solutions for a wide range of smartphones as well as IoT products. The 'Exynos 7570' is a quad-core product with CPU performance improved by 70% and power efficiency by more than 30% compared to the previous 28nm generation product.
In addition, it features integrated connectivity functions including Wi-Fi, Bluetooth, FM radio, and Global Navigation Satellite System (GNSS), as well as a built-in Cat.4 LTE modem that supports 2CA (Carrier Aggregation). This marks the first time that connectivity functions have also been integrated into a single chip, moving beyond the existing one-chip form that combined the AP and modem.
The 'Exynos 7570' supports FullHD video recording and playback, WXGA resolution, front (8-megapixel) and rear (13-megapixel) camera resolutions, and image signal processing (ISP) functions, so it is expected that even users of entry-level smartphones will be able to more easily enjoy high-resolution and high-spec content.
In addition, by integrating the functions and optimizing the design of peripheral components such as PMIC (Power Management Integrated Circuit) and RF (Radio Frequency) chips, the overall solution area was reduced by more than 20%, enabling the provision of an optimal solution for slim smartphone products required by the market.
"Through this product, more consumers will be able to experience the performance improvements achieved through the 14nm process," said Heo Kuk, Senior Vice President of Strategy Marketing Team at Samsung Electronics' S.LSI Business Division. "In particular, by successfully integrating various connectivity functions perfectly, we will continue to expand our competitiveness in the integrated chip market."
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