Participating in the '2016 Semiconductor Exhibition' held at COEX in Seoul from October 26 to 28
Introduction to Superpower and Sensors, Automotive, Industrial Security Solutions, and High-Efficiency Power Semiconductors

Infineon Technologies (Korea CEO Seung-soo Lee) announced that it will participate in the '2016 Semiconductor Fair' held at COEX in Seoul from October 26 to 28. Infineon, a leader in the global semiconductor solutions market pursuing convenience, safety, and eco-friendliness in daily life, will showcase consumer power and sensor solutions, automotive solutions, industrial security solutions, and high-efficiency power semiconductors (Infineon Booth No.: C140). The main exhibits are as follows.

300mm thin film wafer

Infineon is the first company in the industry to produce power semiconductors using 300mm thin-film wafers. Switching from the currently standard 200mm diameter thin-film wafers to 300mm can lower the cost per unit by 20 to 30 percent at maximum operation.

Driver monitoring system using a 3D camera

3D cameras utilizing Time-of-Flight (ToF) technology precisely measure the distance to an object by transmitting modulated infrared light and receiving signals reflected from the object. By detecting motions related to Advanced Driver Assistance Systems (ADAS) as well as monitoring the driver's condition, they can significantly contribute to the driver's convenience and safety.

24GHz Radar Sensor Solution

Infineon introduces the 'BGT 24' series of ultra-compact MMIC transceivers utilizing the 24GHz frequency band, along with a reference design development board featuring an integrated antenna and microcontroller. It can be utilized in a wide range of applications, from simple motion detection sensors that replace PIR sensors in industrial, consumer, and IoT sectors, to rear blind spot detection in automobiles and detection of object distance, angle, speed, and presence.

Security solutions for smart factories

As smart factories develop rapidly worldwide, security issues are becoming a major concern. The manufacturing industry of the future will consist of more decentralized and automated smart factories that rely entirely on network technology. Security is a top priority that must be established to realize Industry 4.0.

Security applications required for building the Industrial Internet include component and equipment authentication, system integrity monitoring and assurance, and the protection of data, communications, and intellectual property rights. Infineon's OPTIGA™ Trust authentication solution and OPTIGA™ TPM (Trusted Platform Module) provide hardware-based security solutions to safely protect various IoT platforms and systems from external security attacks and hacking threats.

In addition, the company exhibits high-performance (AOP, Acoustic Overload Point) MEMS microphones for high-performance audio used in the latest mobile phones, 3D magnetic measurement sensor solutions capable of measuring magnetic fields and temperature along the x-axis, y-axis, and z-axis, and high-efficiency power semiconductor solutions including PrimePACK™ power modules featuring 1200V SiC Schottky diodes with no reverse recovery charge and innovative .XT interconnection technology.

In addition, on the 26th, at the 'IP-SoC Design Conference' which shares system semiconductor market trends and technology development strategies, Lee Seung-soo, CEO of Infineon Technologies Korea, will deliver a keynote speech on the topic of 'Growth Engines of the Automotive Semiconductor Market'.