Europe's largest research project for the research and development of highly integrated electronic SiP (System-in-Package) solutions has been launched. The ESiP (Efficient Silicon Multi-Chip System-in-Package Integration) project, aimed at enhancing the reliability and enabling testing of complex ultra-small microelectronic systems, involves 40 microelectronics companies and research institutions from nine European countries. The project is led by Infineon Technologies and is scheduled to run until April 2013. SiP (System-in-Package) refers to the process of embedding multiple distinct chips side-by-side or stacking them in layers within a single chip package.

As a result of the ESiP project, Europe will gain a leading position in the development and manufacturing of ultra-small microelectronic systems. In the future, multiple chips with various manufacturing techniques and structural widths will be integrated into standard chip packages for diverse applications. Examples of these include specialized 45nm processors, high-frequency 90nm transceiver chips, sensors, and passive components such as ultra-small capacitors or specialized filters. The objective of ESiP is to research the reliability of new manufacturing processes and materials required for SiP implementation. The project will also develop new methods for error analysis and testing. In the future, the results of the ESiP project will be applied to electric vehicles, medical equipment, and communication technology devices.

SiP technologies are understood as foundational technologies for future microelectronic systems, enabling the implementation of technically complete solutions, such as microcameras, within the ultra-small space of a single SiP package. This involves the stacking of various chips (3D integration), intelligent integration, and integration into functional chip packages. In the ESiP project, Infineon will contribute to the development of system integration solutions composed of multiple microchips, as well as to the improvement of error analysis, reliability, and testing.

ESiP's research partner organizations
In addition to Infineon Technologies AG and Siemens AG, German research partners include SMEs such as Team Nanotec GmbH, Feinmetall GmbH, Cascade Microtech Dresden GmbH, InfraTec GmbH, and PVA TePla Analytical Systems.