Production cooperation for next-generation high-speed I/O connectors, as well as backplane connectors and cable assemblies

Molex and TE Connectivity announced a Dual Source Alliance (DSA) agreement to produce backplane connectors and cable assemblies, as well as next-generation high-speed I/O connectors for data communication applications.

Molex (www.molex.com), a global leader in electronic connectors, and TE Connectivity (TE; www.te.com) have agreed to cooperate in launching and promoting new connector and cable assembly products that enable high-speed applications required by data centers, as data centers are trending toward upgrades due to the increase in hyperscale models and virtualization platforms.

The DSA agreed upon by the two companies supports not only current data speeds but also speeds up to 56Gbps. The agreement also includes next-generation connector products. Accordingly, the DSA aims to open a new chapter in the partnership and technological cooperation between the two companies by establishing a second source of standards for products such as zSFP+ interconnects, zQSFP+ interconnects, CDFP interconnects, microQSFP interconnects, and nano-pitch I/O interconnects.



The content of the DSA specifies that the two companies will go beyond simply producing similar products. Specifically, it aims to develop and commercialize high-speed solutions consisting of interoperable connectors, cages, and cable assemblies. The DSA also includes self-testing by both companies, under which TE and Molex will conduct cross-tests on select products and provide these test reports to customers. This helps ensure product compatibility and minimize customer product approval time.

These shared goals between the two companies are ultimately intended to help reduce customer costs and improve system efficiency and productivity. In addition, TE and Molex plan to support customers' design and quality control processes more quickly by bringing products compliant with DSA regulations to market faster.

Data centers are rapidly evolving to provide high-density, high-speed, and rich virtualization models. High-performance, high-speed connectors and cable assemblies must support the system data requirements of new data storage, servers, switches, routers, and other applications. Because these connectivity products generally provide superior high-speed electrical performance, sophisticated connector and cable assembly designs equipped with advanced features such as high-speed signal processing, EMI isolation, and thermal efficiency are required.

The goal of the technology alliance between the two companies is to produce connectors and cable assemblies possessing these critical characteristics. Through this, both companies will provide their respective customers with products of unified specifications more quickly, thereby reducing the risk of customers having to separately adopt solutions from two different companies.

James O'Toole, President of TE Connectivity Communication Solutions, stated, “This agreement focuses on TE and Molex providing customers with more flexible future solutions. The data communications industry is changing faster due to the growth of data and high-speed communication occurring in almost every industrial application.” “Through this agreement, we will be able to better meet the needs of clients requiring the latest technologies and solutions,” he said.

Meanwhile, Molex COO Joe Nelligan said, “Molex is very pleased with its collaboration with TE Connectivity. As the market requires next-generation connector technology to meet the demand for high-speed processing, the collaboration between the two companies will provide an opportunity to more actively address these needs through mutually testable dual-source products.”