Focus on 5-Way Optimization, Aura RGB Lighting, and enhanced durability.
Differentiation among the four mainboard lineups

ASUS unveiled its 2017 motherboard lineup for the first time on the 17th. The new products, which guarantee optimal compatibility with Intel's latest 7th-generation Kaby Lake processor, incorporate ASUS's proprietary technologies and are said to be suitable for gaming, DIY, design, and programming environments.

Key features to note in the new products include 5-Way Optimization, Aura RGB lighting, and enhanced durability technologies. While there are differences across products, some include ideas like covering the rear of the motherboard with a backplate to enhance durability and enabling the use of 3D-printed accessories.



Key features of this new series include 5-Way Optimization technology, which enables one-click overclocking and powerful cooling, and a high-performance audio chipset with a 113dB SNR. Furthermore, compared to previous generations, it features enhanced gaming sound with 3D sound technology. Furthermore, AURA software allows for seamless integration between the motherboard and peripherals, allowing for free control of LED colors.

The 2017 lineup, the 200 series, is divided into four series: PRIME series, ROG series, ROG STRIX series, and TUF series.

The PRIME series supports Aura RGB LED customization and even includes the Aura Sync feature, which allows you to synchronize RGB effects with other Aura-enabled devices. Equipped with 5-Way Optimizatiom technology and Fan Xpert 4 technology.

Durability has also been enhanced with SafeSlot technology. By inserting and molding metal into the PCI Express slot, the slot is 1.6 times stronger than conventional slots and has over 1.8 times greater shear resistance. Furthermore, the power supply utilizes durable chokes and Japanese capacitors, ensuring stable power supply even in extreme temperatures ranging from -55°C to 105°C.

In addition to providing excellent expandability supported by the next-generation Z270, H270, and B250 chipsets, it fully supports M.2 devices boasting data transfer speeds of up to 32 Gbps, and provides dual M.2 ports to support various RAID configurations and even INTEL® OPTANE™ memory technology.


▲ROG series (left), TUF series (right)

The ROG series is targeted at gaming and hardcore environments.

The ROG MAXIMUS IX FORMULA features signature ROG RGB armor and a backplate that covers the entire rear of the board. At the same time, the power supply is equipped with an EK waterblock, allowing you to easily create a custom liquid cooling environment and check coolant temperatures with the built-in software. Additionally, the I/O shield is integrated into the side I/O port.

The new ROG MAXIMUS IX CODE model, a new addition to the ROG series, features the same ROG armor as the Formula and a phosphate-coated heatsink. It also features the SupremeFX S1220 sound solution based on ROG's exclusive S1220 sound codec, Sonic Studio III technology, ASUS Aura, and Aura Sync.

The ROG STRIX features a well-rounded motherboard design, ASUS Aura features, and a 3D-printed design.
It can utilize the Aura function to provide RGB LED lighting effects, and the 3D printing-friendly design allows for customization around the M.2 port and heatsink. In addition, the interface's 5-Way Optimization function allows for easy optimization of the entire system, and it is equipped with gaming-specific functions such as SupremeFX sound solution, Sonic Studio III, and Sonic Radar III. It supports Intel Gigabit LAN and NVMe M.2 ports.

The TUF series targets environments that demand durability and stability, undergoing over 7,000 hours of compatibility testing. Thermal Armor covers over 70% of the motherboard, providing dust and moisture resistance, while specialized port design increases durability by over 60%. The TUF Fortifier backplate attached to the rear of the motherboard also prevents bending and damage to the electrical circuitry. Dual Intel LAN ports provide network balance, minimizing errors and delays in data transmission.