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Antenna coupler reduction using innovative packaging technology

Google 우선 소스Published2011.09.27 10:01

Antenna coupler reduction using STMicroelectronics' innovative packaging technology
Improved connection reliability and battery life

Korea, September 26, 2011 – STMicroelectronics ( www.st.com ), a world-leading integrated semiconductor company, announced two new chips for controlling antenna performance in mainstream 3G wireless products. The new products are more than 83% smaller than earlier components and improve energy efficiency to maximize battery life for always-on-the-go consumers and operators.

The latest multi-functional multi-band mobile phones and smartphones, as well as tablets and 3G USB dongles, continuously adjust transmitter performance to optimize network connectivity whenever environmental conditions change. This operation ensures the reliability of network connections and maximizes battery life by varying transmission performance. Antenna couplers perform this constant adjustment function by monitoring the power radiated by the antenna. While most couplers measure the power radiated by the antenna, ST's bidirectional devices also measure reflected power to improve control and efficiency.


The CPL-WB-00D3 and DCPL-WB-00D3 are single-path and dual-path antenna couplers developed for single-antenna and dual-antenna systems. By integrating attenuators on the coupling and isolation ports, the antenna couplers simplify circuit design while reducing cost and PCB space. This additional integration was achieved through ST's proprietary IPD (Integrated Passive Device) technology, whereas other types of couplers require a separate attenuator. Furthermore, insulating glass-substrate processing and wafer-level packaging reduce the overall height and footprint of the device compared to alternative LTCC (Low-Temperature Co-fired Ceramic) technology.

The new product provides ST's ultra-small bidirectional coupler with an IPD inductor using the latest innovative technology, measuring 1.3mm x 1.0mm, which is smaller than the initial 1.7mm x 1.4mm. The further miniaturized packaging provides additional PCB space inside 3G devices. With low insertion loss, high directivity, and a wide operating frequency range, the antenna coupler is compatible with all 3G network standards, ranging from GSM/EDGE to WCDMA/TD-SCDMA.

Key Features of CPL-WB-00D3 and DCPL-WB-00D3:
• 50Ω Nominal Input/Output Impedance
• Operating frequency range: 824MHz~2170MHz
• Insertion loss of 0.2dB or less
• Normal coupling factor of 34dB
• 25dB normal directivity
• size:
• 1300µm x 1000µm x 690µm (CPL-WB-00D3)
• 1670µm x 1440µm x 650µm (DCPL-WB-00D3)

CPL-WB-00D3 and DCPL-WB-00D3 are currently being supplied in mass production, and the price per unit is $0.215 and $0.305, respectively, based on a supply volume of 1,000 units. Prices are negotiable for larger volumes.

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