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Molex Korea Launches SMT Header for HSAutoLink System Supporting Connected Cars

Preferred source on GooglePublished2017.04.21 06:05
Molex Korea has introduced a surface mount version of a right-angle SMT header for the next-generation HS AutoLink interconnect system.

This system provides high-speed technology to meet the rising data bandwidth requirements for vehicle-to-vehicle communication, infotainment, and telematics in the connected car field. The right-angle SMT header, which meets the industry standard USCAR-30, is a product that complies with all USB 2.0, LVDS (Low Voltage Differential Signaling), 1394, and BroadR-Reach automotive Ethernet electrical and EMI shielding requirements for automotive and commercial vehicle applications.

The right-angle SMT header design optimizes available reverse PCB space. The housing's side rib structure stabilizes the PCB during the one-step process, and the high-temperature durable plastic housing protects all internal components during lead-free, reflow soldering. Additionally, flexible packaging options, including rigid trays, tapes, and reels, support fully automated assembly.

Laurent Stickeir, Molex Global Product Manager, said, “The newly released SMT right-angle header for HSAutoLink interconnect systems offers various mounting options to help customers optimize their manufacturing processes. The product’s integrated design ensures a durable connector interface with high integrity.”
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김자영 Reporter

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