Providing flexibility and efficiency to industrial, automotive, and consumer markets
Accelerating the development of intelligent vision devices for edge equipment

Lattice Semiconductor announced the launch of the Embedded Vision Development Kit, the first development kit optimized for mobile-influenced system designs requiring a flexible, low-cost, low-power image processing architecture.

This solution, which integrates a combination of Lattice’s FPGA, ASSP, and programmable ASSP (pASSP) products into a single modular platform, provides the flexibility and energy efficiency required by various embedded vision applications in the industrial, automotive, and consumer markets.

By combining the CrossLink pASSP mobile bridging device, the ECP5 low-power small form factor FPGA, and the high-bandwidth, high-resolution HDMI ASSP, Lattice provides a solution that accelerates the development of intelligent vision devices used in edge equipment.



Deepak Boppana, Director at Lattice Semiconductor, stated, “As intelligent edge computing increases, the number of applications requiring integrated embedded vision technology will continue to grow,” adding, “Lattice’s embedded vision development kits will accelerate the adoption of mobile-related applications in fields such as machine vision, smart control cameras, robotics, AR/VR, drones, and advanced driver assistance systems (ADAS).”r />
The CrossLink input board includes a dual-camera HD image sensor supporting the MIPI CSI-2 interface, eliminating the need for additional external video sources. The ECP5-based board enables low-power pre- and post-processing and supports Helion Vision's HD Image Signal Processor (ISP) IP. It also includes a NanoVesta connector that supports external image sensor video input. The HDMI output board, based on the Sil1136—a version that does not support HDCP—supports connectivity for standard HDMI displays.