Infineon Launches Discrete IGBT with Integrated Maximum Rated Diode
Published2017.06.12 10:51Infineon Technologies has released a 75A/1200V discrete IGBT with a maximum rated diode integrated in a TO-247PLUS package.
TO-247PLUS 3-pin and 4-pin packages are suitable for applications requiring high power density with a 1200V blocking voltage, such as drives, photovoltaics, and UPS (uninterruptible power supplies), as well as for battery charging and energy storage systems.
Compared to the standard TO-247-3 package, the new TO-247PLUS package can provide double the current rating. By eliminating screw holes, the PLUS package allows for the use of a larger lead frame area, enabling the mounting of larger IGBT chips.
We are now able to offer a 1200V IGBT with a maximum capacity of 75A that integrates a diode with the same footprint as existing products. The TO-247PLUS package has a wider lead frame, resulting in lower thermal resistance and thus improved heat dissipation capabilities.
For designers seeking to improve switching losses, the TO-247PLUS 4-pin package provides an additional Kelvin emitter source pin. Additionally, system power density can be increased by using 1200V IGBTs available in TO-247PLUS 3-pin and 4-pin packages. This allows for a reduction in the number of power devices used in parallel, as well as improvements in system efficiency or thermal conditions.
Comments
Related news
Infineon Launches D2PAK 7-pin+ Package MOSFET Family
Infineon Technologies has launched a 40V StrongIRFET™ MOSFET product family offered in a D2PAK 7pin+ package. The new MOSFET product family delivers an extremely low RDS(on) of 0.65mΩ and industry-leading current delivery capacity, enhancing robustness and reliability in high power density applications requiring high efficiency and dependability. Additionally, the surface-mount D2PAK 7pin+ package is well-suited for use in low-voltage drives, battery-powered tools, and lightweight electric vehicles.
2017.04.27by 김지혜 기자
Infineon provides best-in-class thermal performance and insulation package technology that simplifies manufacturing
Infineon Technologies announced the provision of a new package technology. By applying package technology to TRENCHSTOP and TRENCHSTOP Highspeed 3 IGBTs, the company achieved best-in-class thermal performance and simplified manufacturing. This can replace fully isolated packages and standard and high-performance insulation papers. The new package is suitable for PFC (power factor correction) applications in air conditioners, UPS (uninterruptible power supply), and drive power converters. The conventional method of using insulation materials in FullPAK or standard TO packages for isolation is costly and difficult to handle. Additionally, it does not meet the heat dissipation requirements of modern high-power-density IGBTs. The TRENCHSTOP enhanced insulation package has the same footprint as the standard TO-247 and provides 100 percent isolation without requiring insulation paper or thermal grease. The IGBT die provides an effective and reliable thermal path to the heatsink, allowing for increased power density.
2017.05.30by 김자영 기자
Infineon Launches Intelligent Power Module Integrated into a Single Package
Infineon Technologies announced the launch of a new CIPOS™ Mini with integrated PFC (power factor correction) functionality. These intelligent power modules (IPM) integrate a single-switch boost PFC stage and a three-phase inverter in a single package, reducing system costs and bill of material (BOM). This frees up additional PCB space for integrating additional functions. They are suitable for controlling induction motors and permanent magnet synchronous motors (PMSM) with single-phase PFC in variable speed drives commonly used in air conditioning systems and low-power motor drives with maximum power capacity up to 2kW.
2017.06.01by 김지혜 기자
Intel Unveils Next-Generation 'Core Ultra Series 3' and vPro Platform for Enterprise PCs
Intel has officially unveiled the "Intel Core Ultra Series 3" for next-generation enterprise PCs and the latest vPro platform, addressing a wide range of demands from enterprise notebooks to high-performance workstations.
2026.03.26by 배종인 기자
ROHM Launches ESD Protection Diode Compatible with High-Speed Interfaces of 10Gbps or Higher
Semiconductor specialist ROHM has developed the 'RESDxVx series' of ESD (electrostatic discharge) protection diodes capable of responding to next-generation high-speed data communication environments exceeding 10Gbps, simultaneously enhancing both signal quality maintenance required in high-speed interfaces and IC protection performance.
2026.03.26by 배종인 기자
