This page was machine-translated and may differ from the original. View original
Jens, Senior Vice President at NXP: "We will accelerate connected car development by strengthening cooperation with Harman"
Expanding cooperation in new technology fields such as OTA, Secure V2X, and SDR
SafeAssure Program Supporting Functional Safety Introduced in Korea
NXP Semiconductors, which has been leading the global automotive semiconductor market since its merger with Freescale, is expanding its collaboration with Harman for future connected cars.
It has decided to further expand its partnership with Harman International, a powerhouse in connected technology, to accelerate the development of connected cars. NXP, the number one player in the automotive infotainment semiconductor field, has maintained a close cooperative relationship with Harman, a wholly owned subsidiary of Samsung Electronics, for 15 years.
While existing infotainment devices took up a lot of space and were function-oriented, they are now evolving into slim, integrated platforms capable of network connectivity and upgrades, and companies are responding rapidly. The strengthening of cooperation between NXP and Harman can be said to have stemmed from the recognition of the potential impact these changes would have on technology and applications across almost all fields.

Jens Hinrichsen, Senior Vice President of NXP Semiconductors’ Automotive Business Unit, who visited Korea, also stated at a press conference, “We have expanded the scope of cooperation beyond simply being a customer supplying products to Harman to a relationship where we can mutually develop technologies suitable for new infotainment systems.”
Accordingly, NXP and Harman will further strengthen their history of collaboration in new technology fields such as Over-The-Air (OTA) updates, secure V2X communication, and Software Radio (SDR). In particular, they plan to focus on technologies that enhance the in-car experience of connected cars, including tuners, digital signal processors, amplifiers, and application processors. Harman, a key customer of NXP’s latest infotainment solutions, will actively collaborate with NXP in the early development stages, including co-authoring product specifications, exchanging initial samples, and continuously introducing new concept vehicles in partnership with partners such as Rinspeed.

David Slump, Executive Vice President (EVP) at Harman, said, “I believe it is wise to resolve quality issues, a major concern in the automotive sector, through long-term partnerships rather than having any single company pursue this alone.” "I am grateful to be able to provide the best solutions for automakers and drivers through a long-term partnership with NXP," he said.
Support for the development of automotive functional safety certified products
Meanwhile, NXP Semiconductors announced that it is introducing its SafeAssure program, FS45 and FS65 products, and the latest System-Based Chips (SBCs) to the domestic market and supporting the rapid development of fully market-certified safety systems.

The NXP SafeAssure program supports Battery Management Systems (BMS), radar, and functional safety solutions, and simplifies the safety design process. It also provides proactive capabilities to block risks, secure consumer trust, and respond to continuously expanding safety requirements for electric vehicles.
The newly introduced FS45 and FS65 products support the development of robust system-level functional safety systems and provide energy-efficient buck-boost DC-DC, fail-safe LIN, and CAN FD (flexible data) configurable safety mechanisms.
The latest SBCs are for automotive applications such as battery management systems, electric power steering (EPS), electric and hybrid vehicles, as well as advanced drive systems like start & stop and transmission control. Both products provide a 'fail silent' function that enables predictive response after a failure, as well as device behaviors that software designers can configure to meet specific system safety objectives. With the configurable fail silent function, various safety concepts and ISO 26262 Automotive Safety Integrity Level D can be met.
SafeAssure Program Supporting Functional Safety Introduced in Korea
NXP Semiconductors, which has been leading the global automotive semiconductor market since its merger with Freescale, is expanding its collaboration with Harman for future connected cars.
It has decided to further expand its partnership with Harman International, a powerhouse in connected technology, to accelerate the development of connected cars. NXP, the number one player in the automotive infotainment semiconductor field, has maintained a close cooperative relationship with Harman, a wholly owned subsidiary of Samsung Electronics, for 15 years.
While existing infotainment devices took up a lot of space and were function-oriented, they are now evolving into slim, integrated platforms capable of network connectivity and upgrades, and companies are responding rapidly. The strengthening of cooperation between NXP and Harman can be said to have stemmed from the recognition of the potential impact these changes would have on technology and applications across almost all fields.
Jens Hinrichsen, Senior Vice President, Automotive Business Unit, NXP Semiconductors
Jens Hinrichsen, Senior Vice President of NXP Semiconductors’ Automotive Business Unit, who visited Korea, also stated at a press conference, “We have expanded the scope of cooperation beyond simply being a customer supplying products to Harman to a relationship where we can mutually develop technologies suitable for new infotainment systems.”
Accordingly, NXP and Harman will further strengthen their history of collaboration in new technology fields such as Over-The-Air (OTA) updates, secure V2X communication, and Software Radio (SDR). In particular, they plan to focus on technologies that enhance the in-car experience of connected cars, including tuners, digital signal processors, amplifiers, and application processors. Harman, a key customer of NXP’s latest infotainment solutions, will actively collaborate with NXP in the early development stages, including co-authoring product specifications, exchanging initial samples, and continuously introducing new concept vehicles in partnership with partners such as Rinspeed.
David Slump, Executive Vice President (EVP) at Harman, said, “I believe it is wise to resolve quality issues, a major concern in the automotive sector, through long-term partnerships rather than having any single company pursue this alone.” "I am grateful to be able to provide the best solutions for automakers and drivers through a long-term partnership with NXP," he said.
Support for the development of automotive functional safety certified products
Meanwhile, NXP Semiconductors announced that it is introducing its SafeAssure program, FS45 and FS65 products, and the latest System-Based Chips (SBCs) to the domestic market and supporting the rapid development of fully market-certified safety systems.
Jens Hinriksen, Senior Vice President
The NXP SafeAssure program supports Battery Management Systems (BMS), radar, and functional safety solutions, and simplifies the safety design process. It also provides proactive capabilities to block risks, secure consumer trust, and respond to continuously expanding safety requirements for electric vehicles.
The newly introduced FS45 and FS65 products support the development of robust system-level functional safety systems and provide energy-efficient buck-boost DC-DC, fail-safe LIN, and CAN FD (flexible data) configurable safety mechanisms.
The latest SBCs are for automotive applications such as battery management systems, electric power steering (EPS), electric and hybrid vehicles, as well as advanced drive systems like start & stop and transmission control. Both products provide a 'fail silent' function that enables predictive response after a failure, as well as device behaviors that software designers can configure to meet specific system safety objectives. With the configurable fail silent function, various safety concepts and ISO 26262 Automotive Safety Integrity Level D can be met.
본 기사에 대한 정정·반론·추후보도 청구는 보도 청구 안내를, 그간 게재된 보도문은 정정·반론보도 모아보기를 참고해 주세요.














