February 2, 2012 – Movidius, a mobile multimedia processing company, announced today that it has entered into a partnership with Toshiba Electronics Europe (TEE) to develop a complete 3D system solution targeting the smartphone market.

Mobidus’s MA1178 is combined with and utilized in Toshiba’s 8-megapixel EDOF (extended depth of field) camera to enable 3D camera module manufacturers to provide superior 3D imaging solutions, making it ideal for high-end smartphones. EDOF cameras offer significant advantages over conventional autofocus products in terms of 3D synchronization.

Mobidus's MA1178 dual ISP and video processor chip features automatic measurement and setup capabilities and integrates seamlessly into existing mobile phone platforms, simplifying the design process and lowering manufacturing costs. The Toshiba 8-megapixel EDOF camera and the Mobidus MA1178 support perfect focus matching for stereoscopic images, delivering excellent 3D photo quality. This system solution offers customers the flexibility to configure symmetrical or asymmetrical setups using two 8-megapixel EDF cameras or an EDOF camera combining 8-megapixel and 3-megapixel sensors.

In the highly competitive mobile phone market, high-quality 3D imaging capabilities provide mobile manufacturers with the opportunity to differentiate their products from competitors by delivering the best HD 3D experience and enjoyment to consumers.

Shiro Ando, Vice President of Toshiba Electronics Europe, said, “Mobidus’s Myriad 3D solution provides multimedia capabilities that surpass other competitors in the mobile 3D market. Mobidus’s leading 3D imaging capabilities, combined with the high functionality of Toshiba’s EDOF cameras, help mobile phone manufacturers meet consumer demand for an excellent 3D mobile experience.”

Sean Mitchell, CEO of Mobidous, said, “We are very pleased to partner with Toshiba to develop leading 3D solutions,” and added, “Customers seeking product differentiation in the highly competitive mobile phone market will be able to benefit from Mobidous’s innovative and highest-quality 3D imaging solutions, along with Toshiba’s leading position as an EDOF camera supplier in the global mobile phone market.”

Mobidius plans to demonstrate its 3D system solutions, along with the MA1178 product, at the 2012 MWC held in Barcelona, Spain, later this month. To schedule a consultation at Mobidius's booth # 2.1E51 during the event, please send an email to pr@movidius.com .