Used in high-performance applications such as artificial intelligence, machine learning, and big data mining

Vicor introduces Power-on-Package modular current multipliers for high-performance, high-current, CPU/GPU/ASIC (XPU) processors.

Vicor's Power-on-Package solution, which eliminates losses associated with current transfer from the motherboard to the XPU without the need for XPU socket pins, enables higher current transfer for maximum XPU performance.

As the demand for high-performance applications such as artificial intelligence, machine learning, and big data mining increases, XPU operating current is increasing to the hundreds of amperes level. The load-side power architecture, a high-current power supply placed near the XPU, mitigates power distribution losses on the motherboard but does not address interconnection issues between the XPU and the motherboard.

As the XPU current increases, the short distance between the XPU and the structure consisting of the motherboard conductor and interconnect within the XPU socket becomes a limiting factor for XPU performance and overall system efficiency.

Vicor's XPU package-mounted Power-on-Package Modular Current Multipliers (MCMs) further extend the efficiency, density, and bandwidth benefits of the existing Vicor Power architecture already installed in 48V Direct-to-XPU motherboard applications.

The MCM, acting as a current multiplier mounted on the bottom or outer edge of the XPU package lead, is driven by a specific ratio of the XPU current delivered from an external Modular Current Driver (MCD).

The MCD mounted on the motherboard drives the MCM to accurately regulate the XPU voltage with high bandwidth and low noise. This solution, consisting of two MCUs and one MCD, can deliver a peak current of 640A and a continuous current of up to 320A to the XPU.

Two new Power-on-Package devices to be presented at the Open Data Center Committee (ODCC) meeting in Beijing, China on August 22 are the MCM3208S59Z01A6C00 Modular Current Multiplier (MCM) and the MCD3509S60E59D0C01 Modular Current Multiplier Driver (MCD). Multiple MCMs operate in parallel to increase current capacity.

The MCM's small (32mm x 8mm x 2.75mm) package and low-noise characteristics make it suitable for mounting noise-sensitive high-performance ASICs, GPUs, and CPUs together. The operating temperature range is -40°C to +125°C. These devices are the first series of products in a Power-on-Package solution portfolio designed to meet various XPU requirements.