ST's iNEMO MEMS Module Provides Innovation for Advanced Motion Sensing Capabilities
Multi-sensor device integrating 6 DoF in a 20 mm³ size

Korea, September 15, 2011 – STMicroelectronics ( www.st.com ), the world's leading integrated semiconductor company and No. 1 supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer electronics and portable devices, announced a new advanced iNEMO inertial module that integrates 3-axis linear and 3-axis angular motion sensing capabilities into a 4mm x 5mm x 1mm package. Because ST's latest multi-sensor module is approximately 50% smaller than currently mass-produced devices while providing the highest sensing precision and stability, it opens up new possibilities for high-precision gesture and motion recognition capabilities in mobile phones, game controllers, personal navigation systems, and other smart consumer electronics devices.

The new iNEMO 6DoF (degrees-of-freedom) module is fully software compatible with ST's latest 3-axis digital accelerometer (LIS3DH), gyroscope (L3GD20), and other sensors. Therefore, customers using ST's single-function sensors can easily upgrade their designs by utilizing the new product, which combines size reduction and excellent reliability at the package level. The new module solution provides precise adjustment capabilities for the reference axes of two sensors and ensures excellent temperature and mechanical stability due to its advanced mechanical sensing structure.

ST's LSM330DLC multi-sensor module provides angular rate sensing capabilities of 250 dps to 2500 dps along the pitch, roll, and yaw axes, along with a user-selectable full-scale acceleration range from 2 g to 16 g. In addition, it addresses power constraints in battery-powered portable devices by incorporating power-down and sleep modes, as well as an embedded FIFO (first-in first-out) memory block for smarter power management. Furthermore, it can operate at all supply voltages ranging from 2.4 V to 3.6 V.

ST's new iNEMO 6DoF inertial module is aimed at a variety of applications, including motion-driven user interfaces for mobile phones, tablets, and other smart consumer electronics, dead-reckoning and map-matching functions for personal navigation devices, intelligent power saving and free-fall detection functions for portable electronic devices.
The LSM330DLC multi-sensor module utilizes the same micromachining process technology that ST has successfully applied to over 1.54 billion motion sensors already sold, and engineering samples are currently available. The price is set at $3.20 per unit for supply quantities of 1,000. For larger quantities, inquiries can be made to ST sales offices.

LSM330DLC is the smallest 6DoF device in ST's iNEMO inertial module family, consisting of complementary multi-axis single-package devices designed to provide enhanced user experience and motion-sensing reality in mobile phones, game controllers, and other consumer electronics devices.