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Suitable for applications such as smartphone chargers and laptop adapters
Infineon Technologies has launched the CoolMOS P7 product in SOT-223 package.
Designed for drop-in compatibility with DPAK, it is perfectly compatible with standard DPAK footprints and is suitable for applications such as smartphone chargers, laptop adapters, TV power supplies, and lighting.

CoolMOS P7 is designed to meet the demands of the low-power SMPS market. It combines outstanding performance and ease of use, and enables the utilization of an improved form factor. Additionally, by utilizing superjunction technology with excellent price competitiveness, customers can reduce overall BOM (bill of materials) costs.
The SOT-223 package, more cost-effective than DPAK, is widely used in price-sensitive markets. The thermal performance of SOT-223 package CoolMOS P7 was evaluated across various applications. When SOT-223 was laid out to a DPAK footprint, the temperature increased by a maximum of 2-3°C compared to standard DPAK, and when copper area was 20mm² or greater, thermal performance became equivalent to DPAK.
Infineon Technologies has launched the CoolMOS P7 product in SOT-223 package.
Designed for drop-in compatibility with DPAK, it is perfectly compatible with standard DPAK footprints and is suitable for applications such as smartphone chargers, laptop adapters, TV power supplies, and lighting.
CoolMOS P7 is designed to meet the demands of the low-power SMPS market. It combines outstanding performance and ease of use, and enables the utilization of an improved form factor. Additionally, by utilizing superjunction technology with excellent price competitiveness, customers can reduce overall BOM (bill of materials) costs.
The SOT-223 package, more cost-effective than DPAK, is widely used in price-sensitive markets. The thermal performance of SOT-223 package CoolMOS P7 was evaluated across various applications. When SOT-223 was laid out to a DPAK footprint, the temperature increased by a maximum of 2-3°C compared to standard DPAK, and when copper area was 20mm² or greater, thermal performance became equivalent to DPAK.
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