Techday
This page was machine-translated and may differ from the original. View original

Breaking industry records with the launch of record-breaking speed 28nm products

Google 우선 소스Published2012.02.20 09:31

Accelerate high-bandwidth systems with Virtex-7 FPGAs, meet aggressive cost/power requirements with Kintex-7 FPGAs, and achieve unrivaled performance/flexibility with Zynq-7000 EPP.

Xilinx Korea (Country Manager Ahn Heung-sik) February 20, 2012 – Xilinx announced that it has achieved an industry-unprecedented performance of over $1 billion by winning design awards for its latest product families, the new 28nm FPGA and Scalable Processing Platform (EPP) devices.

To date, Xilinx has shipped thousands of Virtex®-7, Virtex-7 2000T 2.5D stacked silicon interconnect (SSI), KINTEX™-7, and Zynq™-7000 devices to over 90 customers worldwide for 350 different designs. Using Xilinx’s 28nm devices, design teams can easily migrate designs between product families encompassing a full product portfolio for diverse application sets and scalable system builds. These applications include high-performance defense radar and video processing systems, advanced 200G wired communication bridges and LTE wireless devices, ultra-high-resolution medical imaging, advanced tools for life science research, vehicle driver assistance systems for life protection, and high-precision factory automation equipment.

"L-3 WESCAM is using a new 28nm product line that implements Xilinx's next-generation advanced video processing algorithms for surveillance and targeting products to reduce electronic size and power consumption," said Steve Tritchew, CTO of L-3 WESCAM. "The Zynq Scalable Processing Platform (EPP) has added a high-performance, industry-standard dual-core ARM A9 processor auxiliary system that further increases electronic device integration while reducing complexity and power consumption." "We expect Xilinx's next-generation software tools to help accelerate product development by significantly reducing compile-to-execute times and providing support for open industry standards for IP libraries that need to greatly improve IP reuse efficiency," the company said.

The combination of Xilinx’s 28nm architecture and TSMC’s 28nm HPL (High Performance/Low Power) process, along with a diverse portfolio of market-tailored devices, enabled the company to achieve the fastest time-to-market in the PLD industry. Xilinx shipped four out of five product families in just 11 months, a result that takes less than half the time required for the initial device launch of only two product families in the previous generation. Additionally, Xilinx launched three new 7 Series Targeted Design Platforms (TDPs) to accelerate system development and integration. These are the first of over 40 products to be offered by Xilinx and its ecosystem members, supporting embedded and high-speed connectivity applications as well as the automotive, broadcast, consumer, industrial, and telecommunications markets.

"History shows that the first PLD suppliers delivered products to new process nodes that ensured significant advantages over the product's lifespan. The 28nm node is expected to be a particularly important step for PLDs by enabling these devices to perform meaningful system functions in devices that combine hardware and software programmability, and by providing capabilities that outperform the industry's market growth rate." "Xilinx is expected to accelerate its momentum with a diverse range of 28nm product families to meet increasing customer requirements," he said.

Xilinx has launched more than 10 devices and is expected to showcase samples of all its 28nm products by mid-2012. The KINTEX-7 K325T device recently passed rigorous quality standards and is being prepared for shipment to a wide range of customers in the June quarter. The HPL process, suitable for TSMC, has significantly accelerated Xilinx's timeline to market and is generating superior revenue compared to the previous generation, following the company's aggressive roadmap.

"TSMC is pleased to partner with Xilinx for the successful launch of its 28nm devices," said Sajiv Dalal, Vice President of TSMC North America. "We are facing increasing customer demand for TSMC's 28nm HPL process technology. TSMC's 28nm HPL process provides the leakage reduction and high performance characteristics required by advanced technology customers, ranging from high-performance systems to mobile consumer applications."

Xilinx is not only providing customers with rapid access to 28nm technology but is also accelerating high-bandwidth systems with Virtex-7 FPGAs in the fastest-growing segment of the FPGA market and meeting aggressive cost and power requirements with Kintex-7 FPGAs. The remaining 7 Series product family, Artix™-7, is designed to address high-volume, cost-sensitive markets. Xilinx is meeting demands for unrivaled system performance, flexibility, and integration with the Zynq-7000 EPP, a new class of system-on-chip that combines 28nm programmable logic architecture with industry-standard ARM® dual-core processing systems. In some applications, a single Zynq-7000 EPP device can replace a processor, DSP, and FPGA.

본 기사에 대한 정정·반론·추후보도 청구는 보도 청구 안내를, 그간 게재된 보도문은 정정·반론보도 모아보기를 참고해 주세요.
명세환 기자
명세환 기자