TI Korea (CEO Kent Jeon, www.ti.com/ww/kr ) March 29, 2012 – Texas Instruments (TI) (NASDAQ: TXN) today announced that it is offering bare die options as a way to further diversify its semiconductor package options. TI’s bare die program allows customers to place orders of as little as 10 pieces for initial prototyping and purchase large quantities in waffle trays for full-scale production. In addition, the bare die option enables integration of multiple functions into a smaller area. As electronic products and systems continue to shrink and become more integrated, TI’s bare die program enables customers to design end products with smaller form factors by implementing multi-chip modules (MCMs) or systems-in-package (SiPs). (For more information on availability and pricing, visit www.ti.com/baredie-pr .)

Moving to a more integrated packaging solution can reduce weight and power consumption, while improving overall system-level reliability in space-constrained applications. Bare die options are currently available for select products in TI's analog, power management, DSP and MCU product lines. Additional product selections can be reviewed and requested through TI's HiRel product group. Bare die is suitable for smart card, mobile RFID reader, medical, industrial, security and high-reliability applications.

Key Features and Benefits
• Space savings: Bare die allows integrated ICs to be implemented in smaller form factors, helping designers leverage them for space-constrained applications such as smart cards and other chip-on-board (COB) devices.
• Functional integration: Customers who want to implement MCM can integrate desired components such as amplifiers, data converters, and power devices onto a single substrate.
• Minimum quantity order possible: Small orders of as little as 10 pieces are possible for initial prototype work, and then large orders of waffle trays are possible for full-scale production.
• Expanded die ordering supply chain: Select bare die products are available for order through TI authorized distributors and at www.ti.com
• Most comprehensive bare die offering: Customers can accelerate time to market with the widest range of small order options

More information about TI's bare die
• TI’s complete bare die portfolio: www.ti.com/baredie-pr
• For more information about TI’s packaging: www.ti.com/packagingoptions-pr

TI's packaging
For TI, semiconductor packaging is a critical element in all aspects including design, technology, quality and mass production. TI's leadership in packaging technology is based on decades of expertise that has enabled it to continuously advance power density, reliability, high performance, low power and cost. TI's comprehensive portfolio of packaging types offers customers thousands of different products, packaging configurations and technologies to solve their challenges and differentiate their products. TI also continues to invest in developing and manufacturing innovative packaging in its state-of-the-art facilities around the world. (For more information, visit www.ti.com/packagingoptions-pr .)