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Next-Generation High-Performance Inertial Modules for Consumer Applications Unveiled
April 2, 2012, Seoul — STMicroelectronics (NYSE:STM), a global semiconductor company in various electronic device applications and a leader in MEMS for consumer and portable applications, has added a fully integrated 9-degree-of-freedom sensor module to its iNemo sensor family to enable location-sensitive applications, location-based services, and indoor navigation for smaller form factor portable devices.
The combination of motion and position sensing has created new opportunities in the market for smartphones, tablets, and other portable devices, such as personal navigation devices. Market research firm IHS iSupplies forecasts that 4 billion motion sensors will be supplied to the mobile phone and media tablet market in 2015. ST's latest iNEMO inertial sensor family combines a 3-axis accelerometer, a 3-axis gyroscope, and a 3-axis magnetic sensor into a single package, providing a new high-performance module featuring a 9-degree-of-freedom inertial sensor.
The LSM333D, the first 9-axis module in this product family, reflects the maximum performance of each discrete sensor, leveraging ST's unique packaging expertise, over 600 MEMS patents, and experience in supplying over 2 billion sensors to the market to date. Furthermore, ST's expertise in MEMS technology has enabled mass production of this module, allowing smartphone designers to easily implement system integration with this product, which supports context-sensitive advanced features.
Roberto De Nuccio, Business Development Manager for ST’s Analog, MEMS and Sensors Group, stated, “Just 12 months ago, the footprint of a single sensor was typically 16 mm³, but ST has integrated three sensors into a 16 mm³ footprint.” He added, “The combination of these technological advancements and superior sensor performance has enabled smartphone manufacturers to deliver added value to end users and provide new features.”
The LSM333D, offered as a 9-degree-of-freedom system-in-package, simplifies product design and reduces PCB space by approximately 30% compared to discrete solutions. Additionally, product designers can implement indoor navigation, location-based services, dead reckoning, and advanced motion and position sensing using sensor fusion software. The module's outstanding performance and integration lay the foundation for context-sensitive, next-generation advanced applications and services.
Other benefits of the LSM333D include an integrated temperature sensor and smart power management to extend terminal battery life. Additionally, the ability to choose between I2C and SPI connections to the main system controller provides designers with greater flexibility that competing modules cannot offer.
Key Features of LSM333D
• Selectable from ±2 to ±12 gauss
• Selectable linear acceleration from ±2 to ±16 g
• Selectable rotational acceleration from ±250 to ±2000 dps
• SPI and I2C serial interfaces
• Smart Power Management
• User-configurable interrupt generator for free fall/motion/magnetic field detection
• Built-in temperature sensor
• Built-in FIFO (first in first out)
The LSM333D is currently available in a 3.5 x 6 x 1mm package, and a 4 x 4 x 1mm package with a 16mm³ footprint is scheduled for mass production soon. For pricing information or to request samples, please contact your nearest ST sales office or visit the address below to place an order through a distributor.
http://www.st.com/internet/com/ordering/buy_from_distributors.jsp
Key Achievements of ST MEMS Business
• Established the world's first dedicated 8-inch manufacturing line among major manufacturers (2006)
• Achieved 1 billion MEMS shipments, November 2010
• Recorded $650 million in MEMS sales in 2011, a 50% market share in the consumer accelerometer market, and a 70% market share in the MEMS gyroscope market (IHS iSupplies)
• Announcement of shipment of 2 billion MEMS devices in February 2012
• Currently holds over 600 MEMS-related patent family products
• A pioneer in integrating plastic packaging and MEMS technology, utilizing advanced packaging know-how to avoid mechanical stress on sensitive MEMS elements
The combination of motion and position sensing has created new opportunities in the market for smartphones, tablets, and other portable devices, such as personal navigation devices. Market research firm IHS iSupplies forecasts that 4 billion motion sensors will be supplied to the mobile phone and media tablet market in 2015. ST's latest iNEMO inertial sensor family combines a 3-axis accelerometer, a 3-axis gyroscope, and a 3-axis magnetic sensor into a single package, providing a new high-performance module featuring a 9-degree-of-freedom inertial sensor.
The LSM333D, the first 9-axis module in this product family, reflects the maximum performance of each discrete sensor, leveraging ST's unique packaging expertise, over 600 MEMS patents, and experience in supplying over 2 billion sensors to the market to date. Furthermore, ST's expertise in MEMS technology has enabled mass production of this module, allowing smartphone designers to easily implement system integration with this product, which supports context-sensitive advanced features.
Roberto De Nuccio, Business Development Manager for ST’s Analog, MEMS and Sensors Group, stated, “Just 12 months ago, the footprint of a single sensor was typically 16 mm³, but ST has integrated three sensors into a 16 mm³ footprint.” He added, “The combination of these technological advancements and superior sensor performance has enabled smartphone manufacturers to deliver added value to end users and provide new features.”
The LSM333D, offered as a 9-degree-of-freedom system-in-package, simplifies product design and reduces PCB space by approximately 30% compared to discrete solutions. Additionally, product designers can implement indoor navigation, location-based services, dead reckoning, and advanced motion and position sensing using sensor fusion software. The module's outstanding performance and integration lay the foundation for context-sensitive, next-generation advanced applications and services.
Other benefits of the LSM333D include an integrated temperature sensor and smart power management to extend terminal battery life. Additionally, the ability to choose between I2C and SPI connections to the main system controller provides designers with greater flexibility that competing modules cannot offer.
Key Features of LSM333D
• Selectable from ±2 to ±12 gauss
• Selectable linear acceleration from ±2 to ±16 g
• Selectable rotational acceleration from ±250 to ±2000 dps
• SPI and I2C serial interfaces
• Smart Power Management
• User-configurable interrupt generator for free fall/motion/magnetic field detection
• Built-in temperature sensor
• Built-in FIFO (first in first out)
The LSM333D is currently available in a 3.5 x 6 x 1mm package, and a 4 x 4 x 1mm package with a 16mm³ footprint is scheduled for mass production soon. For pricing information or to request samples, please contact your nearest ST sales office or visit the address below to place an order through a distributor.
http://www.st.com/internet/com/ordering/buy_from_distributors.jsp
Key Achievements of ST MEMS Business
• Established the world's first dedicated 8-inch manufacturing line among major manufacturers (2006)
• Achieved 1 billion MEMS shipments, November 2010
• Recorded $650 million in MEMS sales in 2011, a 50% market share in the consumer accelerometer market, and a 70% market share in the MEMS gyroscope market (IHS iSupplies)
• Announcement of shipment of 2 billion MEMS devices in February 2012
• Currently holds over 600 MEMS-related patent family products
• A pioneer in integrating plastic packaging and MEMS technology, utilizing advanced packaging know-how to avoid mechanical stress on sensitive MEMS elements
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