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Samsung Electronics Leads the Ultra-High-Capacity Storage Market with Mass Production of 30.72TB SAS SSDs
2.5-inch size, double the performance/capacity of existing SSDs
Samsung Electronics has launched the '30.72TB SAS (Serial Attached SCSI) SSD' (PM1643), which has up to twice the capacity and performance of the existing product (15.36TB SAS SSD).
The '30.72TB SAS SSD' is the largest capacity single form factor storage currently in mass production, including HDDs.
With this, Samsung Electronics has opened up the ultra-high-capacity SSD market with approximately 1,000 times the capacity of the 32GB SSD for ultra-mobile PCs (UMPCs) that it created in 2006.
The '30.72TB SAS SSD' is a 2.5-inch product that features ▲ 32 1TB V-NAND packages ▲ an ultra-high-speed dedicated controller ▲ 10 4GB DRAM packages using TSV technology ▲ and ▲ the latest ultra-high-capacity dedicated firmware technology, doubling the capacity compared to existing products while further enhancing performance.
Samsung Electronics has implemented the world's first 1TB NAND package by stacking 512Gb 3-bit V-NAND in 16 layers, and by mounting 32 of them, it has enabled the storage of 5,700 full HD movies (1920×1080, 5GB) in a single 2.5-inch SSD.

It also replaces the 9 main/sub controllers of existing SSDs with 1 controller, increasing internal space utilization while increasing random read speed by up to 2 times, providing user convenience.Maximized the effect of the feeling.
The 4GB DRAM package utilizes TSV technology to stack four 8Gb DDR4 chips, maximizing DDR4 performance. This marks the first time a DRAM package utilizing TSV technology has been incorporated into an SSD product.
The product has sequential read/write speeds of 2,100 MB/s and 1,700 MB/s, which are more than three times faster than SATA SSDs, and random read/write speeds of 400,000 IOPS (input/output operations per second) and 50,000 IOPS, respectively.
Reliability is especially important for enterprise storage systems such as data centers, and in addition to metadata preservation technology and data storage/recovery technology in the event of a momentary power failure, the new 64-layer V-NAND ECC (Error Correction Code) technology has been installed to further enhance system stability.
“We have opened a new horizon in the ultra-high-capacity storage market with the world’s first mass production of a 30.72TB SSD,” said Han Jae-soo, Vice President of Strategy and Marketing at Samsung Electronics’ Memory Business Division. “We will continue to actively respond to the growing demand for ultra-high-capacity SSDs exceeding 10TB and lead the premium memory storage market optimized for next-generation systems.”
Samsung Electronics has launched the '30.72TB SAS (Serial Attached SCSI) SSD' (PM1643), which has up to twice the capacity and performance of the existing product (15.36TB SAS SSD).
The '30.72TB SAS SSD' is the largest capacity single form factor storage currently in mass production, including HDDs.
With this, Samsung Electronics has opened up the ultra-high-capacity SSD market with approximately 1,000 times the capacity of the 32GB SSD for ultra-mobile PCs (UMPCs) that it created in 2006.
The '30.72TB SAS SSD' is a 2.5-inch product that features ▲ 32 1TB V-NAND packages ▲ an ultra-high-speed dedicated controller ▲ 10 4GB DRAM packages using TSV technology ▲ and ▲ the latest ultra-high-capacity dedicated firmware technology, doubling the capacity compared to existing products while further enhancing performance.
Samsung Electronics has implemented the world's first 1TB NAND package by stacking 512Gb 3-bit V-NAND in 16 layers, and by mounting 32 of them, it has enabled the storage of 5,700 full HD movies (1920×1080, 5GB) in a single 2.5-inch SSD.
It also replaces the 9 main/sub controllers of existing SSDs with 1 controller, increasing internal space utilization while increasing random read speed by up to 2 times, providing user convenience.Maximized the effect of the feeling.
The 4GB DRAM package utilizes TSV technology to stack four 8Gb DDR4 chips, maximizing DDR4 performance. This marks the first time a DRAM package utilizing TSV technology has been incorporated into an SSD product.
The product has sequential read/write speeds of 2,100 MB/s and 1,700 MB/s, which are more than three times faster than SATA SSDs, and random read/write speeds of 400,000 IOPS (input/output operations per second) and 50,000 IOPS, respectively.
Reliability is especially important for enterprise storage systems such as data centers, and in addition to metadata preservation technology and data storage/recovery technology in the event of a momentary power failure, the new 64-layer V-NAND ECC (Error Correction Code) technology has been installed to further enhance system stability.
“We have opened a new horizon in the ultra-high-capacity storage market with the world’s first mass production of a 30.72TB SSD,” said Han Jae-soo, Vice President of Strategy and Marketing at Samsung Electronics’ Memory Business Division. “We will continue to actively respond to the growing demand for ultra-high-capacity SSDs exceeding 10TB and lead the premium memory storage market optimized for next-generation systems.”
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