Newly enhanced solution to enable high-performance XPU operation

Vicor has launched a Power-on-Package (PoP) ChiP set that includes Modular Current Multipliers (MCMs) required for high-performance GPUs, CPU processors and ASICs, such as XPUs.

The 'Power on Package' current multiplier module increases current and distributes voltage close to the XPU from the 48V source, enabling advanced levels of XPU performance.

Power distribution efficiency and system density surpass the limitations of 12V input multi-phase voltage regulators that lack current multiplexing. Power-on-Package enables the technology required for high-current artificial intelligence processors and 48V autonomous driving systems.

The 'Power-on-Package' module is built on top of the Power Architecture (FPA) system used in high-performance computers and large-scale data centers.

FPA supports not only efficient power distribution but also direct conversion of 48V to sub-1V GPUs, CPUs, and artificial intelligence ASICs. By placing current multiplication close to high-current processors, 'power-on-package' current multiplier modules overcome existing obstacles and improve performance.

The combination of the MCM4608S59Z01B5T00 (Modular Current Multiplier: MCM) and the MCD4609S60E59H0T00 (Modular Current Multiplier Driver: MCD) modules provides 600A of continuous current and up to 1,000A of peak current at 1V. The current multiplier modules, with their high density, small package size, and low noise, are a very suitable solution when mounted on or near an XPU substrate.