April 30, 2012, Seoul – STMicroelectronics (NYSE:STM), a global semiconductor company leading in various electronic device applications, has unveiled the 'DIP1524', a miniature diplexer for 4G smartphones that enables excellent GPS performance as well as a slim design.

4G smartphones must utilize multiple wireless connections to provide mobile ultra-high-speed internet services of 100 Mbps or higher. Some terminal receivers with built-in Bluetooth, Wi-Fi, and GPS share antennas to save space.

Accordingly, ST introduced the 'DIP 1524', the smallest antenna sharing diplexer of 1.14 mm² that uses the latest packaging technology to deliver high signal strength to multiple RF receivers simultaneously while occupying minimal space.

Efficient antenna connectivity is crucial for a device's GPS function, and smartphones equipped with the DIP1524 can enjoy various benefits, including faster GPS operation and accurate location detection, as well as more precise location-based services through strong signal connections with multiple satellites.

Meanwhile, the DIP1524 diplexer utilizes ST’s Integrated Passive Device (IPD) technology, which uses a glass wafer to minimize insertion loss compared to a ceramic wafer, and has the same footprint as a flip-chip package. This allows for saving approximately 65% of PC board space compared to existing packages with a footprint of 3mm² or more. Additionally, it is characterized by the ability to connect GPS/GLONASS satellites, Bluetooth, Wi-Fi, and LTE Band 7 to a single antenna.

[Key Features of DIP1524]
• GPS insertion loss: up to 0.65 dB
• GLONASS Insertion Loss: Max. 0.75 dB
• No change in performance
• Excellent channel isolation
• No dispersion between components

The DIP1524 is currently being sampled in a 4-bump flip-chip package. The price is $0.129 per unit for orders of 1,000 or more, and the price for bulk orders is negotiable.