Presenting over 10 products across four product groups, including build-up PCBs and rigid-flexible PCBs.

LG Innotek will participate in the Korea Circuit Industry Exhibition (KPCA show 2018), held at KINTEX in Goyang-si, Gyeonggi-do from the 24th to the 26th, to showcase its advanced electronic circuit board technology.

The International Electronic Circuit Industry Show (IECI) is Korea's only exhibition specializing in electronic circuits. Each year, approximately 250 domestic and international companies participate, sharing the latest technology trends and information. Electronic circuit boards (PCBs) are a core component of the neural circuitry of electrical and electronic products like smartphones, smart cars, TVs, and PCs, transmitting various electrical signals between components.

At this exhibition, LG Innotek will introduce approximately 10 types of ultra-precision electronic circuit boards in four product groups: Build-up PCB, Rigid Flexible PCB, Tape Substrate, and Package Substrate.

First, in the build-up PCB used as the main circuit board of smartphones, we will present differentiated products such as ultra-thin HDI (High Density Interconnection), embedded PCB, and SLP (Substrate Like PCB).

In particular, SLP is a product that applies semiconductor packaging technology to existing HDI, and is attracting attention as a next-generation main board because it is smaller and can process more information.

Rigid-Flexible PCB introduces a hybrid type of board that combines a rigid PCB with a flexible PCB to increase usability. This product is bendable and allows for three-dimensional circuit connections while increasing component mounting density.

In tape substrates, LG Innotek showcases its technological prowess with products such as 2-metal COF (2-metal Chip-on-Film) and smart ICs. These products utilize LG Innotek's unique ultra-fine manufacturing techniques, including Fine Pitch Patterning technology.

A two-metal COF is a film-type substrate that connects display panels, driver chips, and main boards in devices like smartphones and TVs. It features microcircuits designed on both sides. Used in high-resolution flexible displays like OLED, this product is expected to see significant market expansion.

The package substrate product line introduces semiconductor package substrates used in mobile application processors (APs) and memory. System-in-Package (SiP), which integrates integrated circuits (ICs) and other components within a single semiconductor package, is particularly notable.

A company official said, “As smart devices become more multifunctional and miniaturized, their substrates are also becoming more high-performance and highly integrated,” and “You will be able to see ultra-precision substrate technology optimized for each application field, such as smartphones, APs, and memory.”