5G and Connected Product Manufacturing
10x Faster Runtime Innovation

Ansys has established a partnership with HiSilicon, a global fabless semiconductor company and subsidiary of Huawei, for the development and production of next-generation mobile, networking, artificial intelligence, and 5G products. HiSilicon plans to accelerate semiconductor production for next-generation smart product innovation by extensively applying Ansys's solutions to power integrity and reliability analysis.
Through the multi-year contract established this time, HiSilicon will use Ansys's semiconductor and power simulation solution portfolio for power integrity and reliability sign-off. This portfolio not only generates chip power models for full package and system-level simulation but also addresses complex multi-physics problems such as on-chip thermal effects, aging, thermally-aware statistical electromigration (EM) budgeting, and electrostatic discharge (ESD). HiSilicon has successfully advanced designs on all advanced process nodes, including 7nm and 5nm, utilizing ANSYS RedHawk-SC.

Catherine Xia, Director of Platform Business at HiSilicon, stated, "For large design sizes and advanced process technologies for next-generation chips, resolving power integrity issues is the greatest challenge above all." She added, "Despite these challenges, Ansys RedHawk-SC has demonstrated results more than 10 times faster than previous versions. With 15 times less memory consumption and high accuracy, it is proving to be of tremendous help in enabling us to continue innovation in the global market."

John Lee, Vice President at Ansys, emphasized, "As a leader in semiconductor technology, HiSilicon, which is working to solve the industry's greatest challenges, requires cutting-edge solutions that deliver fast and accurate results. Therefore, RedHawk-SC, which is the first big data architecture ever created for electronic system design and simulation, is the right fit." He further stated, "In fact, 7-nanometer RedHawk customers are using or deploying RedHawk-SC for sign-off on complex products and designs."

He added, "Through our partnership with HiSilicon, we are able to bring reliable, high-performance products to market faster while reducing power and costs. Going forward, Ansys will continue to spare no effort in supporting the successful development and innovation of our customers and partners."