SiP Module Achieving BT Certification and ULP Mark Verification
Compact Single Solution Integrating All Passive Components
On Semiconductor announced on the 12th a new 6 x 8 x 1.46mm system-in-package (SiP) module, expanding its Bluetooth 5 certified wireless system-on-chip (SoC) RSL10 product family. The RSL10 devices, supporting Bluetooth Low Energy wireless profiles, can be easily implemented in all connected applications including sports, fitness, mobile health wearables, smart locks, and consumer appliances.

The RSL10 SiP integrates an embedded antenna, RSL10 wireless system, and all passive components into a single compact solution. Having obtained Bluetooth SIG (Special Interest Group) certification, the RSL10 SiP eliminates the need for additional RF design considerations, accelerating time-to-market while significantly reducing development costs.

Supporting industry-leading low power consumption and implementing 2Mbps data rates using Bluetooth 5 technology, the RSL10 product family delivers advanced wireless capabilities without compromising battery life. The RSL10 consumes only 62.5nW in deep sleep mode and 7mW in peak receive mode. The energy efficiency of RSL10 has also been validated through EEMBC's ULP Mark. RSL10 became the first device in this benchmark test history to exceed 1,000 ULP Marks, achieving Core Profile scores twice as high as competing solutions.

Michel De Mey, Vice President and Senior Director of Audio Devices, Consumer Health, and Bluetooth Connectivity Solutions at On Semiconductor, stated, "RSL10 is already being used in various applications including energy harvesting and industrial IoT," adding, "With the addition of this new SiP that significantly reduces not only design effort and costs but also time-to-market, the possibilities for RSL10 have become even more limitless."