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Impedance Matching Design Guide
As electronics advance and devices operate at higher speeds, high-speed signal design has become increasingly common.
Most of these signals require impedance matching. From a PCB perspective, as data transmission speeds increase with DDR, HDMI, S-ATA, USB and similar interfaces, the design approach is shifting from parallel transmission methods to serial transmission methods.
In this seminar, we will approach impedance matching from a practical PCB design perspective, drawing on various materials and field experience. We will cover which signals require impedance matching, explain why differential pairs are used as signals transition to high-speed operation, clarify the differences between stripline and microstrip which are commonly discussed during impedance work, and provide understanding of propagation delay, which is one of the key reasons for length matching in DDR and similar applications. Finally, we will examine what considerations must be observed when implementing impedance matching and how DDR is designed.
Most of these signals require impedance matching. From a PCB perspective, as data transmission speeds increase with DDR, HDMI, S-ATA, USB and similar interfaces, the design approach is shifting from parallel transmission methods to serial transmission methods.
In this seminar, we will approach impedance matching from a practical PCB design perspective, drawing on various materials and field experience. We will cover which signals require impedance matching, explain why differential pairs are used as signals transition to high-speed operation, clarify the differences between stripline and microstrip which are commonly discussed during impedance work, and provide understanding of propagation delay, which is one of the key reasons for length matching in DDR and similar applications. Finally, we will examine what considerations must be observed when implementing impedance matching and how DDR is designed.
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