Teledyne LeCroy Accelerates PCIe® 7.0 Technology for AI Workloads
Teledyne LeCroy (Branch Manager Lee Woon-jae) is unveiling PCI Express® 7.0 signal generation, transmission, and measurement capabilities, acceleratin…
2024.02.05 by 배종인 기자
Applied, Supporting 'With Harmony Orchestra Program' for 5 Consecutive Years
Applied Materials Korea (CEO Park Kwang-seon), a global leader in materials engineering solutions, has taken the initiative in coexisting with local c…
2024.02.05 by 배종인 기자
UNIST develops mechanical metamaterials that overcome the limitations of existing materials
A research team led by Professor Kim Ji-yoon from the Department of Advanced Materials Science and Engineering at UNIST (President Lee Yong-hoon) has …
2024.02.05 by 배종인 기자
UNIST, Hyundai Motors Join Hands for Next-Generation 3D Printing
UNIST (President Lee Yong-hun) and Hyundai Motor Company (CEO Lee Dong-seok) have signed a mutual cooperation agreement for the operation of a joint r…
2024.02.05 by 배종인 기자
KETI, the first fine dust simple measuring device performance certification agency in Honam region
Korea Electronics Technology Institute (KETI, Director Shin Hee-dong) Gwangju Regional Headquarters has been designated as the first fine dust simple …
2024.02.05 by 배종인 기자
Anand Namveer, Senior Vice President, Merck-“AI Trends to Drive Semiconductor Industry Recovery in 2024”
Following the press briefing by Merck, this publication met with Anand Nambiar, Chief Commercial Officer, to discuss the outlook for the semiconductor…
2024.02.05 by 성유창 기자
Merck, “DSA to enhance EUV utilization for ultra-fine semiconductors”
Global materials company Merck held a press briefing at the Shilla Stay in Samsung-dong, Seoul, with the semiconductor business president from its Ger…
2024.02.05 by 배종인 기자
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Electromagnetic Waves and AI (1) - "AI Leading Innovation in Electromagnetic Wave Design and Analysis"
Artificial intelligence (AI) is driving innovation by converging and integrating with science and technology across various fields. In the electromagn…
2024.02.02 by 권신혁 기자
Mouser to Offer BLE and IEEE 802.15.4 Embedded Modules for Matter and IoT Devices
Mouser Electronics announced on the 2nd that it supplies Espressif Systems' ESP32-H2-MINI-1x module.
2024.02.02 by 김예지 기자
Creaform Opens Registration for Free Web Conference: "Sharing Digital Manufacturing Insights Through Industrial 3D Measurement Technology"
Creaform will hold "Creaform Connect Korea 2024" on Thursday, February 22nd with the theme of "Current State and Future of Digital Manufacturing Innov…
2024.02.02 by 김예지 기자
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Equinix, “80% of companies will operate subscription-based digital infrastructure by 2026”
Global digital infrastructure company Equinix announced its annual Global Interconnection Index (GXI) 2024 on the 1st. According to the report, it is …
2024.02.02 by 김예지 기자
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Infineon and Honda Join Forces for Automotive Semiconductor Development
Infineon Technologies (Korea CEO Lee Seung-su) has signed a Memorandum of Understanding (MoU) with Honda Motor to establish strategic cooperation.
2024.02.02 by 배종인 기자
Eco-friendly organic battery life improved with new electrolyte
A research team led by Professor Kwak Won-jin from the Department of Energy and Chemical Engineering at UNIST (President Lee Yong-hun) has jointly dev…
2024.02.01 by 배종인 기자
Korea's First Commercial-Scale Liquid Hydrogen Production Facility, the 'Changwon Liquid Hydrogen Plant,' Begins Full-Scale Operation
The completion ceremony for the 'Changwon Liquefied Hydrogen Plant,' Korea's first commercial-grade liquefied hydrogen production facility, was held o…
2024.02.01 by 성유창 기자
UK-Korea, Love Call for Semiconductor Collaboration...UK Semiconductor Seminar Held
A venue for strengthening semiconductor cooperation between Korea and the United Kingdom has been established, bringing together leading British semic…
2024.02.01 by 권신혁 기자