[e4ds Tech Day 2026 ⑥] Dong-Joo Shin, Mobilint CEO, "Winner of Physical AI Era is AI SoC, Not GPU"
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Lam Research Achieves 15,000 Korean-Manufactured Chamber Units Shipment and Launches Semiconductor Venture Fund
Lam Research has achieved the cumulative shipment of 15,000 semiconductor manufacturing chamber units produced in Korea and secured over 1 trillion wo…
2026.10.08 by 배종인 기자
Samsung Electronics, First Quarterly Operating Profit of 100 Trillion Won in Company History
Samsung Electronics surpassed 100 trillion won in quarterly operating profit for the first time in company history in its third quarter provisional re…
2026.10.08 by 배종인 기자
Applied Materials and Intel Collaborate on AI Semiconductor Technology Development
Applied Materials and Intel are collaborating on the development of advanced semiconductor technology for AI computing. By combining the Silicon Valle…
2026.10.07 by 배종인 기자
Xcena and Portrai Join Forces to Build CXL-Based Bio Data Infrastructure
Fabless semiconductor company Xcena and techbio company Portrai are embarking on joint development of large-scale biodata processing infrastructure ba…
2026.10.06 by 배종인 기자
Henkel to Unveil Advanced Packaging Materials for AI and HBM at SEDEX 2026
Henkel will showcase semiconductor high-density packaging solutions for the AI and HBM era at SEDEX 2026. Through advanced materials such as underfill…
2026.10.06 by 배종인 기자
[e4ds Tech Day 2026 ⑥] Dong-Joo Shin, Mobilint CEO, "Winner of Physical AI Era is AI SoC, Not GPU"
At the keynote speech of 'e4ds Tech Day 2026', Dong-Joo Shin, CEO of Mobilint, stated that AI computation is shifting from GPU-centric to AI SoC and N…
2026.10.02 by 배종인 기자
Synopsys Unveils AI Autonomous Engineering Platform 'AgentEngineer'
Synopsys has unveiled the 'AgentEngineer' platform, which applies AI agents across the entire process from semiconductor design to system development.…
2026.10.02 by 배종인 기자
Applied Materials and Besi Expand AI Packaging Partnership
Applied Materials and Besi are expanding their strategic partnership to respond to growing demand for highly integrated semiconductor packaging driven…
2026.10.02 by 배종인 기자
SK Hynix "No Confirmed Matters Related to Solidigm"
SK Hynix stated that there are currently no confirmed matters regarding capital utilization plans related to Solidigm, and all decisions will be made …
2026.10.01 by 배종인 기자
AMD Unveils 'Ryzen AI Max PRO 400'…Supporting Enterprise Local Agentic AI Deployment
AMD has introduced the next-generation 'Ryzen AI Max PRO 400 Series' processor for building enterprise local AI environments, moving forward with its …
2026.09.30 by 배종인 기자
ASM launches PECVD-based 'Flowable Carbon' technology
ASM has launched XP8® Vertos™ Flowable Carbon, a next-generation technology based on PECVD. This technology integrates gap fill and planarization into…
2026.09.30 by 배종인 기자
MathWorks Releases MATLAB·Simulink R2026b
MathWorks released MATLAB·Simulink R2026b on the 30th. New features including Simulink Variant Manager, Visual Inspection Toolbox, and Polyspace Test …
2026.09.30 by 배종인 기자
Applied Materials and KIOXIA to Co-develop Next-Generation Memory at EPIC Center
Applied Materials and KIOXIA are undertaking joint development of next-generation memory for AI at the EPIC Center in Silicon Valley. The two companie…
2026.09.30 by 배종인 기자
Seoul National University launches AI Semiconductor Innovation Institute...fostering 110 AI semiconductor talent through industry-academia collaboration
Seoul National University held an opening ceremony for the 'AI Semiconductor Innovation Institute' on the 29th at Doyeon Hall in the Design Research B…
2026.09.30 by 배종인 기자
Supermicro Begins Shipping NVIDIA Vera Rubin NVL72 Racks
Supermicro has begun shipping NVIDIA Vera Rubin NVL72 racks. Integrating DCBBS and DLC-2 liquid cooling technology, the product supports 1,152 GPUs an…
2026.09.29 by 배종인 기자