High-Performance TVS Diode, Protecting NFC Circuits in Mobile Devices from ESD
Published2012.07.04 08:37July 4, 2012, Seoul - Infineon Technologies (Korea CEO Lee Seung-soo) has launched a new diode series that can protect NFC (Near Field Communications) antennas and front-end devices when overvoltage occurs. The new ESD18VU1B diode series absorbs dangerous ESD (electrostatic discharge) and protects NFC systems from damage.
NFC antennas are typically located on spring-mounted contact points at the top of mobile phones, which are easily accessible, making them vulnerable to ESD that can be easily transmitted to NFC modules and damage or destroy the components. Infineon's new diode is implemented in the signal path between the antenna and NFC modem. This is optimized to meet NFC system requirements through characteristics that balance efficient protection function and signal integrity on RF signal lines.
The new diode series can withstand repeated ESD according to the IEC61000-4-2 industrial standard without any performance loss, and can respond to various discharges within response times of 1ns or less. The features of the ESD18VU1B, which is optimized for protecting NFC circuits, are as follows:
• The inherent dynamic resistance characteristic of 0.6 Ohm is three times lower than other solutions currently available in the market for applications in the same category. This allows the ESD18VU1B diode to clamp 8kV ESD to a minimum voltage level of 28V without any degradation issues.
• Through a bidirectional configuration providing only 0.3pF ultra-low capacitance and high linearity, signal distortion can be minimized even under high-frequency conditions.
• Provides protection function in a maximum AC signal voltage range of ±20V.
• Through minimum power consumption characteristics providing leakage current of 100pA or less under 18V conditions in normal operating mode, battery life of portable electronic devices is extended.
The new ESD18VU1B series is offered in two Infineon standard packages ideal for ultra-miniature electronic devices: TSLP-2-1 (1.0mm x 0.6mm x 0.39mm) and ultra-miniature TSSLP-2-1 (0.6mm x 0.3mm x 0.3mm). These products are lead-free, halogen-free, and RoHS compliant, making them very environmentally friendly.
Availability
The new ESD18VU1B diode is currently being supplied in volume production. To support rapid evaluation of the new products, Infineon provides not only evaluation boards and samples, but also simulation models.
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