Silicon wafer shipments hit lowest level since 17Q4

According to the quarterly analysis of the silicon wafer industry by the SEMI Silicon Manufacturers Group (SMG), global silicon wafer shipments in the first quarter of 2019 fell 5.6% compared to the fourth quarter of 2018 to 3.051 billion in², marking the lowest level since the fourth quarter of 2017.

Silicon wafers are a core material for semiconductor manufacturing and are an essential component of virtually all electronic products, including computers, telecommunications products, and home appliances. Precisely engineered thin, round discs are produced in various diameters ranging from 1 inch to 12 inches and are used as substrate materials to produce most semiconductor devices and chips.

The data released by SEMI SMG this time includes virgin test wafers and epitaxial silicon wafers, as well as polished silicon wafers and non-polished silicon wafers.


Neil Weaver, Chairman of SEMI SMG and Director of Product Development and Applications for Americas at Shin-Etsu Handotai, said, “While silicon wafer shipments this year are somewhat lower compared to the same period last year, the shipment volume itself remains at a high level.”

Meanwhile, the SEMI SMG operates as an independent committee within SEMI and is composed of companies involved in the production of polycrystalline silicon, monocrystalline silicon, and silicon wafers. The group's objective is to develop market intelligence and statistics regarding the silicon industry and the semiconductor market, and to promote collaborative efforts on key issues related to the silicon industry.