| Identical footprint to the previously released FS820R08A6P2x… System developers can rapidly expand inverter performance without major system design changes

Infineon Technologies announced on the 8th that it is launching a new power module for xEV main inverters to enable automotive OEMs to develop a variety of electric vehicles.

The four new HybridPACK Drive module products can be used in inverters with various performance levels ranging from 100 kW to 200 kW. Additionally, the HybridPACK DSC S2, an upgraded version of the existing HybridPACK DSC (Double Sided Cooling), is being introduced. This module is suitable for main inverters in the 80 kW range for hybrid and plug-in hybrid electric vehicles and meets the requirements for high power density.

The new HybridPACK Drive product has the same footprint as the previously released FS820R08A6P2x. System developers can therefore rapidly expand inverter performance without major changes to the system design.

The low-performance HybridPACK Drive Flat 'FS660R08A6P2Fx' and HybridPACK Drive Wave 'FS770R08A6P2x' are cost-optimized products for 100 kW to 150 kW inverters.

These modules differ in heat dissipation performance due to variations in baseplate structure. Instead of the PinFin baseplate, which offers superior cooling performance, the Flat product utilizes a flat baseplate to provide low power output at a lower cost. The Wave product uses a ribbon bond baseplate structure to provide performance intermediate between the Flat and PinFin products.

The high-performance HybridPACK Drive Performance 'FS950R08A6P2B' is suitable for 200kW inverters. It utilizes the same PinFin baseplate as existing modules. By employing special ceramic materials, cooling capacity has been improved by over 20%, enabling higher current performance. Like the Flat and Wave products, it adopts the EDT2 (Electric Drive Train) IGBT generation. All products adopting this chipset exhibit similar electrical operation.

The 'FS380R12A6T4x' is a variant of the Performance product suitable for 150 kW inverters. While it shares the same PinFin baseplate and special ceramic material, it uses a different chipset based on IGBT4 dies to provide a 1200 V blocking voltage, making it the first among these products to do so.

For ultra-fast charging, electric vehicles using battery voltages of 700V or higher require this blocking voltage. IGBT4 is a more economical alternative that can be used instead of SiC modules with a switching frequency in the 8 kHz range.

Infineon has also applied EDT2 technology to the HybridPACK DSC S2 'FF450R08A03P2' module. By using a chipset with a blocking voltage of 750V, it achieves enhanced current density, short-circuit robustness, and excellent light-load power loss. The DSC S2 product features a proven double-sided cooling package and enables short-term operation down to chip junction temperatures of 175°C.

With upgraded chip technology and higher chip temperature operating performance, it achieved 40% improved performance compared to the existing HybridPACK DSC S1 with the same footprint. In addition, it enables high power density, helping system developers overcome space constraints in hybrid and plug-in hybrid systems.

The HybridPACK DSC, a compact half-bridge module, enables various inverter structures. It also supports efficient and safe inverter operation by including on-chip current and temperature sensors.

The new HybridPACK Drive product will be supplied starting in June, and the HybridPACK DSC S2 product starting in July.