Toshiba Memory Acquires Taiwan Lite-On's SSD Business Unit
Published2019.09.02 11:31Toshiba Memory announced on August 30 that it has signed an agreement to acquire Lite-On Technology's SSD business unit.
.jpg)
The purchase price is US$165 million, and the transaction will be closed in the first quarter of 2020. Currently, only customary settlement adjustments and regulatory approvals remain.
Liteon is a Taiwan-based computer storage device manufacturer with extensive experience in manufacturing SSDs used in PCs and data centers.
Toshiba Memory believes that this acquisition will significantly strengthen its SSD business division.
Nobuo Hayasaka, Acting President and CEO of Toshiba Memory, stated, “LiteOn’s SSD business unit is a strategic fit for Toshiba Memory,” adding that it enables the company to focus even more on its SSD business.
"Furthermore, as the use of cloud services increases significantly, the demand for SSDs in PCs and data centers is rising," they stated, adding, "The acquisition of Lite-On in line with market trends will provide dynamic opportunities for Toshiba Memory."
Meanwhile, Toshiba Memory changed its name to 'Kioxia Holdings Corporation' as of October 2019.
Comments
Related news
Toshiba Unveils 2.5-inch NVMe SSD Targeting Data Centers
Toshiba has strengthened its data center NVMe SSD product lineup by adding a 2.5-inch form factor offering. The new PCIe Gen3x4 NVMe SSD uses a 2.5-inch form factor with 7mm height to complement the M.2 22110 product. It can be widely deployed across various applications including data centers. The new product is launched in three capacity options: 960GB, 1920GB, and 3840GB. It delivers sequential read performance up to 2700MB/s and sequential write performance up to 895MB/s within a 7W active power envelope. The product is designed for read-intensive applications such as NoSQL databases, big data analytics, and streaming media.
2019.03.16by 이수민 기자
Toshiba Launches Low-Power Brushed DC Motor Driver IC
Toshiba has launched the brushed DC motor driver IC 'TB67H450FNG'. With a maximum rating of 50V/3.5A, the TB67H450FNG drives motors across a wide operating voltage range and features an HSOP8 compact surface-mount package that improves product sourcing flexibility. It can drive brushed motors in power supplies with varying operating voltages from 4.5V to 44V and supports multiple applications including battery-driven devices, USB battery-driven devices, and industrial 12~36V devices. It also features 3.5A current drive capability that can support applications such as robot vacuum cleaners, refrigerators, home appliance actuators, office equipment, and ATM machines.
2019.06.04by 이수민 기자
Samsung Electronics begins mass production of SSDs and DRAM modules for next-generation servers.
Samsung Electronics has begun mass production of the PM1733 high-performance NVMe SSD lineup based on the PCIe 4.0 interface and high-capacity DRAM modules including RDIMM and LRDIMM. The PM1733 and high-capacity DRAM modules are scheduled to be integrated into new servers alongside AMD's second-generation EPYC processors. The PM1733 supports the PCIe 4.0 interface and delivers sequential read performance of 8,000MB/s and random read performance of 1,500,000 IOPS in NVMe SSD, representing more than double the performance improvement compared to existing PCIe 3.0 interface SSDs. Samsung Electronics' high-capacity RDIMM enables up to 4TB of memory per CPU when utilized.
2019.08.10by 이수민 기자
Intel Unveils Next-Generation 'Core Ultra Series 3' and vPro Platform for Enterprise PCs
Intel has officially unveiled the "Intel Core Ultra Series 3" for next-generation enterprise PCs and the latest vPro platform, addressing a wide range of demands from enterprise notebooks to high-performance workstations.
2026.03.26by 배종인 기자
ROHM Launches ESD Protection Diode Compatible with High-Speed Interfaces of 10Gbps or Higher
Semiconductor specialist ROHM has developed the 'RESDxVx series' of ESD (electrostatic discharge) protection diodes capable of responding to next-generation high-speed data communication environments exceeding 10Gbps, simultaneously enhancing both signal quality maintenance required in high-speed interfaces and IC protection performance.
2026.03.26by 배종인 기자
