Lakefield processors suitable for low-power mobile PCs
Two different cores are stacked using Foveros 3D technology.


On the 11th, Intel released two types of 'Lakefield' processors for low-power mobile PCs.

Intel unveiled the i3-L13G4 and i5-L16G7 processors, which use Foveros 3D technology to stack two logic dies and two DRAM layers in three dimensions, reducing the package area to 12×12×1mm.

The Lakefield processor integrates one Sunny Cove core and four Tremont cores manufactured on a 10nm process. The i3-L13G4 and i5-L16G7 processors communicate in real time with the OS scheduler and appropriately match the cores and applications to run.

Intel officials explained the performance of the i5-L16G7 processor by comparing it to the i7-8500Y processor.

The i5-L16G7 processor has a 56% smaller package size than the i7-8500Y, enabling board size reductions of up to 47%, and its low 2.5mW standby SoC power reduces board standby power by up to 91%.

Additionally, compared to WebXPRT3, web browsing power efficiency per SoC power is up to 24% higher, and compared to SPEC CPU2006, single-threaded integer operation-enhanced application performance is up to 12% higher, officials explained.

Lakefield processors feature native dual internal display monitor capabilities, making them ideal for foldable and dual-screen PCs.

The 'Samsung Galaxy Book S' and 'Lenovo ThinkPad X1 Fold' equipped with Intel Lakefield processors are scheduled to be released within this year.