This page was machine-translated and may differ from the original. View original
Bit Flipping Interferes with MCU Operation in IoT Devices
Maxim MAX32670 MCU with FPU
Prevent bit flipping with ECC function
In IoT applications, environmental challenges such as high-energy particles can cause memory corruption and bit flipping during normal operation, especially when the process node is 40 nm or lower, disrupting MCU operation and leading to inaccurate results.

Accordingly, Maxim Integrated Korea released the 'MAX32670', a low-power Arm Cortex-M4 MCU equipped with a floating point unit (FPU) on the 23rd.
Bit flipping is a phenomenon in which electrical interference occurs through repeated accesses to the same memory row, affecting the memory rows adjacent to that memory row.
The MAX32670 protects all memory (384KB flash and 128KB SRAM) with Error-Code Correction (ECC) to prevent bit flipping.
Active power consumption is 40µW/MHz, which Maxim officials said “executes instructions from flash at 40% lower power than competing solutions.” “It is available in 1.8mm×2.6mm WLP and 5mm×5mm TQFN packages, which are 50% smaller than competing solutions,” he added.
Maxim MAX32670 MCU with FPU
Prevent bit flipping with ECC function
In IoT applications, environmental challenges such as high-energy particles can cause memory corruption and bit flipping during normal operation, especially when the process node is 40 nm or lower, disrupting MCU operation and leading to inaccurate results.

▲ MAX32670 MCU [Image = Maxim]
Accordingly, Maxim Integrated Korea released the 'MAX32670', a low-power Arm Cortex-M4 MCU equipped with a floating point unit (FPU) on the 23rd.
Bit flipping is a phenomenon in which electrical interference occurs through repeated accesses to the same memory row, affecting the memory rows adjacent to that memory row.
The MAX32670 protects all memory (384KB flash and 128KB SRAM) with Error-Code Correction (ECC) to prevent bit flipping.
Active power consumption is 40µW/MHz, which Maxim officials said “executes instructions from flash at 40% lower power than competing solutions.” “It is available in 1.8mm×2.6mm WLP and 5mm×5mm TQFN packages, which are 50% smaller than competing solutions,” he added.
본 기사에 대한 정정·반론·추후보도 청구는 보도 청구 안내를, 그간 게재된 보도문은 정정·반론보도 모아보기를 참고해 주세요.














