TI Launches Industry's Highest Integration Piezo Haptic Driver

With very fast startup time and wide operating performance
Enables fast and flexible haptic feedback in consumer and industrial applications

TI Korea (CEO Jaejin Kim, www.ti.com/ww/kr ) July 26, 2011 – TI has launched the DRV8662, the highest-density piezo haptic driver for the development of mobile devices and industrial products. By integrating a 105V boost converter, power diodes, and a 50V to 200V peak-to-peak (Vpp) fully differential amplifier, the DRV8662 offers a solution size 50% smaller than major competitors. Furthermore, its efficient design, which eliminates the transformer, enables a 40% reduction in total solution costs compared to competitor solutions. The DRV8662 can drive a wide range of piezo actuator voltages and features fast startup times, offering significant advantages to designers seeking to implement high-speed, high-definition haptic designs. (For sample orders and more information, please refer to www.ti.com/drv8662-pr )

"Realistic haptic feedback effects can significantly enhance the user experience of touch-based consumer electronics," said Steve Anderson, Senior Vice President of TI's High Performance Analog Business Unit. "By adopting the DRV8662 haptic driver, effects such as localized vibrations or frequency vibrations can be easily provided to both touchscreen input devices and non-touchscreen devices, ranging from mobile phones and tablets to computer accessories, consumer electronics, and industrial automation consoles."

Key Features and Advantages
• Piezo modules enable fast startup times (1.5 milliseconds), a thin form factor, and high bandwidth, allowing for the implementation of haptic effects impossible with inertia-based actuators.
• Capable of driving piezo actuator capacitances of 50–680 nF at 300 Hz, enabling the implementation of various high-definition haptic effects, including feedback localized to specific parts of the device, as well as vibrations and pulses whose frequency changes depending on how the user interacts with the device.
• Features a wide power range of 3.0–5.5V through a transformerless design and direct battery connection, reducing solution size and cost.
• Includes thermal overload protection to prevent damage when the device is overoperated

Supply timing and price
The DRV8662 is currently available in a 4mm x 4mm x 0.9mm QFN package, and the price is per 1,000 pieces.It is $1.75 based on quantity.

Tools and Support
The DRV8662 evaluation module is available for $100. It includes a fully programmable MSP430G2553 and analog and digital interfaces, enabling comprehensive standalone and in-system evaluation. Additionally, the MSP430 is pre-programmed with sample haptic waveforms, allowing for immediate evaluation. (For more information, including references and sample code, and to order the product, please visit www.ti.com/drv8662evm-pr )

Additionally, simulation models for the DRV8662 are available in TINA-TI 9.1, a SPICE-based analog simulation program. (For TINA-TI 9.1 downloads, see www.ti.com/tina-ti-download-pr )

OMAP compatibility
The DRV8662 can be used with the OMAP™ processor family in touchscreen-based devices such as handsets. By combining the processing power of OMAP devices with the high-definition haptic effects provided by the DRV8662, the user experience can be significantly enhanced.

TI's touchscreen product portfolio
The DRV8662 is a powerful new addition to TI's touchscreen product portfolio and can be used in any design. (For more detailed information on the product, product specifications, and technical data, please refer to www.ti.com/touch-pr)

More detailed information about the DRV8662 and haptic technology
• Order DRV8662 samples and evaluation modules: www.ti.com/drv8662-pr
• TI Haptics Expert Q&A Series on Implementing Piezo Haptic Solutions: www.ti.com/drv8662video-pr
• TI E2ETM Community - Technical support from Fellow Engineers: www.ti.com/touchforum-pr