Seoul, December 6, 2012 – Bridgelux Inc., a global developer of LED lighting technology and solutions, today announced an innovative platform for semiconductor lighting design (product name: Vero™ LED Array). The new Vero LED Array platform simplifies design integration and manufacturing processes associated with LED lighting design, providing designers with more flexible LED lighting solutions.

Vero, a next-generation package array technology, achieves new technological advancements such as design flexibility, ease of use, and energy efficiency, and presents a future-oriented platform capable of integrating smart sensors and wireless communication for smart building control systems and other innovative applications.

Vero's enhanced technology is summarized by the following three features: 1) a new LED array with higher flux density, 2) up to 20% improvement in lumens per watt (lm/W) compared to existing Bridgelux LED array products, and 3) a simple assembly process that simplifies the manufacturing process and improves overall system reliability.

Through the Vero platform, manufacturers can significantly reduce their inventory of electronic and optical components. Additionally, the wide input current range allows designers to optimize products in terms of efficiency, cost, and lighting output.

Jim Miller, Chief Sales and Marketing Officer at Bridgelux, stated, “The Vero platform represents an innovative advancement in LED array packaging technology,” adding, “Vero products are manufactured through a highly automated process, reducing costs and allowing for easy upgrades to future smart applications.” “The Vero array provides customers with the manufacturing and design capabilities necessary to create new design possibilities, ultimately driving the rapid transition to LED lighting,” he said.

Over the past five years, Bridgelux has continuously increased LED efficiency and led the way as a pioneer in Chip-on-Board (COB) technology, while striving to reduce costs for LED-related packaging and other systems. Through these innovative efforts, Vero products represent the next stage of technology.

Vero Platform Technical Specifications
The Vero platform offers a complete range of applications through four form factors. It also provides the lighting output and color temperature required for commercial, hospital, commercial, industrial, residential, and outdoor lighting applications. This array platform delivers performance ranging from 800 lumens in warm white (color temperature 3000K) to up to 20,000 lumens in cool white (color temperature 5000K), along with CCT and CRI Multi options, including the 97 CRI Decor product option.

Vero products offer significantly enhanced lighting fixture design flexibility and provide a light-emitting surface (LES) with higher flux density compared to Bridgelux's existing array designs. Vero LED arrays are designed to operate reliably at higher drive currents than conventional products, thereby increasing performance and further reducing costs. The combination of these new features enables lighting fixture designers to develop smaller and more aesthetically pleasing lighting designs and provides a narrow beam angle suitable for spot and track applications required for high-contrast lighting designs.

The Vero Array is compatible with a wide range of standard drivers and optical components, offering manufacturers greater flexibility and diverse options than conventional products. This shortens design development time and reduces inventory requirements, thereby lowering costs. The new Vero Array series is expected to provide design benefits to numerous lighting fixture manufacturers through enhanced interfaces and connectivity options. Electrical connections can be established via user-friendly solder pads or utilize Molex's solderless onboard connectors. The Vero line combines enhanced light sources and innovative connector options into a single, easy-to-integrate package.

Bridgelux's customers are currently evaluating the Vero platform, and it is planned to be commercialized in the first quarter of 2013.