TI Korea (CEO Kent Tran, www.ti.com/ww/kr ) January 11, 2013 – Wireless connectivity is becoming increasingly important in the automotive industry. This trend is driven by the fact that it not only replaces expensive cables used for communication between in-vehicle devices but also allows users to view or share content from smartphones and tablet PCs through in-vehicle systems, is useful for navigation systems, and offers easy pairing. To meet these requirements, TI (CEO Kent Tran) has launched WiLink 8Q, the automotive family of its 8th-generation wireless connectivity solution, WiLink 8.

The WiLink 8Q family enables unprecedented cross-platform scalability through multi-core and multi-radio wireless technologies, and offers enhanced features such as in-vehicle multimedia streaming via Wi-Fi, hands-free calling via Bluetooth, and A2DP (advanced audio distribution profile) stereo sound simultaneously. Additionally, it enables easy Wi-Fi and Bluetooth pairing via NFC (near field communications), allowing smartphones and tablet PCs to be easily connected to in-vehicle infotainment systems, thereby easily extending the mobile user experience into the in-vehicle user experience. (For user experiences with the WiLink 8Q product family, please refer to the TI Behind the Wheel blog.)

The WiLink 8Q product family supports Wi-Fi Certified Miracast™ and integrates an internal power amplifier (PA), eliminating the need for an external PA Front-End Module (FEM) for cost savings. Another advantage is the ability to fully reuse software across the entire product family. To meet the diverse requirements of automotive infotainment products, the WiLink 8Q solution offers the following three types of combo product families:

· Combo connectivity system-on-chip (SoC) supporting Wi-Fi and Bluetooth
· Highly integrated combo connectivity SoC supporting Wi-Fi, Bluetooth, Bluetooth Low Energy, and NFC
· Super Combo SoC supporting Wi-Fi, Bluetooth Low Energy, NFC, and GNSS (Global Navigation Satellite System)

Mattias Lange, Automotive Connectivity Product Line Manager at TI’s Wireless Connectivity Solutions division, stated, “A robust wireless connectivity solution is required to enable the information and content sharing user experience enjoyed by consumers via smartphones or tablet PCs to be replicated between driver and passenger devices within a vehicle. “Therefore, Wi-Fi, Bluetooth, NFC, and GNSS must work together organically to become the connectivity component that seamlessly integrates the entire system,” he said. “The WiLink 8Q family has taken TI’s expertise in wireless connectivity and automotive applications to the next level by integrating the four wireless radio technologies required for automotive infotainment into a single SoC.”

WiLink 8Q family based on TI's comprehensive solutions
The WiLink 8Q family provides an industry-leading portfolio of wireless connectivity solutions, enhancing the high performance and scalability that TI solutions have traditionally offered, and incorporating advanced Bluetooth and Wi-Fi coexistence technology. As TI's second-generation automotive combo connectivity solution, the WiLink 8Q family can be used with a variety of automotive infotainment processors and is the perfect device for use with TI's automotive OMAP™ processors, the DRA65x (“Jacinto 5”) and the newly released DRA74x (“Jacinto 6”). The DRA74x automotive infotainment processor delivers enhanced performance for future in-vehicle displays, 3D navigation, and high-definition multimedia. In addition, TI also provides powerful software that supports major automotive infotainment product operating systems such as QNX, Linux, and Android as a WiLink 8Q connectivity solution.

TI is demonstrating wireless automotive connectivity solutions at the TI Village in the North Hall of the Las Vegas Convention Center, where CES 2013 is being held.

Supply timing
Initial products of the WiLink 8Q product family are scheduled to begin sample supply in the second quarter of 2013 and mass production supply in the first quarter of 2014. The WiLink 8Q solution is targeted at automotive customers making bulk purchases and is not supplied through distributors.

TI's Innovation and Leadership in Automotive Applications
TI provides highly reliable, advanced semiconductor products to enable manufacturers and system suppliers to deliver world-class capabilities to the automotive market. TI offers comprehensive analog power management, interface, and signal chain solutions, as well as DLP® displays, ADAS, infotainment processors, Hercules™ TMS570 safety microcontrollers, and wireless connectivity solutions. It provides documentation and certifications for all products in accordance with stringent AEC-Q100 and ISO/TS 16949 standards. Additionally, it offers SafeTI™ products compliant with ISO 26262 standards. More detailed information on these products can be found on the TI Automotive webpage.