8-inch wafer fab production volume shows continued growth
Published2021.05.26 09:1122 new 200mm fabs scheduled for construction by '24
Analog applications and China driving regional growth
The Semiconductor Equipment and Materials International (SEMI) announced on the 26th through its latest 200mm fab outlook report that monthly 200mm (8-inch) fab production volume is forecast to grow 17% from 2020 to 2024, reaching approximately 6.6 million wafers produced. This represents a record increase of approximately 950,000 wafers.
Equipment investment in 200mm fabs also exceeded $3 billion in 2020, with forecasts suggesting $4 billion in 2021. Investment in 200mm fabs is viewed as a reflection of global semiconductor companies' efforts to address the worldwide semiconductor shortage.
SEMI CEO Ajit Manocha analyzed, "From 2020 to 2024, 22 new 200mm fabs producing power and analog semiconductors, MOSFETs, MCUs, sensors, and other components are expected to be constructed to meet demand for 5G and IoT devices."
According to SEMI's 200mm fab outlook report showing 12 years of data from 2013 to 2024, foundry is expected to account for more than 50% of 200mm fab production this year, with analog semiconductors at 17% and discrete and power semiconductors at 10% following behind. Regionally, China is anticipated to hold an 18% market share of total 200mm fab production volume, with Japan and Taiwan each expected to account for 16%.
200mm fab equipment investment is expected to maintain over $3 billion in 2022 as well. Of this, approximately half is anticipated to be investment in foundry, with discrete and power semiconductors at 21%, analog semiconductors at 17%, and MEMS and sensor sectors at 7%.
Related news
Power semiconductor fab equipment investment is expected to reach a record high in 2021.
SEMI forecasts that power and compound semiconductor fab equipment investment will rebound in the second half of this year, and is projected to reach a record high of $6.9 billion next year, representing 59% growth compared to this year. As of 2019, 804 power and compound semiconductor production facilities were equipped with monthly wafer production capacity of approximately 8 million wafers based on 200mm wafers, and by 2024, 38 new production facilities are expected to begin operations, with production volume projected to increase by approximately 20% to 9.6 million wafers per month.
2020.05.06by 이수민 기자
How to optimize analog output modules for process control?
Precise actuator control is required to manage process parameters such as pressure, temperature, and flow rate in industrial environments. By using precise analog output modules such as PLC and DCS, voltage and current outputs for actuator control can be generated. In this case, the analog output modules used must be able to withstand harsh industrial environments and provide reliable, precise output.
2021.02.17by 이수민 기자
Minister Moon Seung-wook: "Expanding the 8-inch foundry process."
Minister Moon Seung-wook of the Ministry of Industry, Trade and Resource visited Silicon Mitus, a power semiconductor fabless company, and held a roundtable discussion with the system semiconductor industry, announcing plans to expand 8-inch foundry processes to address semiconductor supply shortages.
2021.05.10by 배종인 기자
Intel Unveils Next-Generation 'Core Ultra Series 3' and vPro Platform for Enterprise PCs
Intel has officially unveiled the "Intel Core Ultra Series 3" for next-generation enterprise PCs and the latest vPro platform, addressing a wide range of demands from enterprise notebooks to high-performance workstations.
2026.03.26by 배종인 기자
ROHM Launches ESD Protection Diode Compatible with High-Speed Interfaces of 10Gbps or Higher
Semiconductor specialist ROHM has developed the 'RESDxVx series' of ESD (electrostatic discharge) protection diodes capable of responding to next-generation high-speed data communication environments exceeding 10Gbps, simultaneously enhancing both signal quality maintenance required in high-speed interfaces and IC protection performance.
2026.03.26by 배종인 기자
