Infineon Technologies (Korea CEO Seung-soo Lee) has introduced a new power MOSFET package that meets the diverse design needs of power system designers and can achieve maximum performance in the smallest space.

Infineon announced on the 15th that it is launching two OptiMOS™ power MOSFET packages based on the innovative TOLL (TO-Leadless) package: TOLG (TO-Leaded with Gullwing leads) and TOLT (TO-Leaded Top-side cooling).

The TOLx product family provides very low RDS(on) and high current ratings of over 300A, improving system efficiency in high power density designs.

The TOLG package combines the best features of the TOLL and D2PAK 7-pin packages, sharing the same 10x11 mm² footprint and electrical performance as TOLL while providing flexibility comparable to the D2PAK 7-pin.

The main advantages of TOLG are particularly evident in designs using aluminum insulating metal substrate (Al-IMS) boards. In this design, the coefficient of thermal expansion (CTE), which describes the tendency of the material's shape to change with temperature change, is higher than that of copper insulating metal substrates and FR4 boards.

Over time, TCoB (temperature cycling on board) causes cracks in the solder joints between the package and the PCB.

TOLG demonstrates excellent solder joint robustness through the flexibility of its gull-wing leads, significantly enhancing product reliability in applications involving repetitive temperature cycles.

The new package achieves TCoB performance twice as high as the IPC-9701 standard requirements.

The TOLT package is optimized for superior thermal performance. By flipping the lead frame to expose the metal on the top surface, this package features multiple gullwing leads on each side to provide high-current drain and source connections. Due to the flipped lead frame, heat is transferred directly from the exposed metal top surface through the insulation to the heatsink. Compared to the TOLL bottom-face cooling package, TOLT improves RthJA by 20% and RthJC by 50%, thereby reducing cooling costs. Additionally, TOLT OptiMOS products can be mounted below the MOSFET, allowing for reduced PCB space.

The OptiMOS TOLx product family is available in various voltage classes for OptiMOS 3 and 5 technologies. TOLG is scheduled to be released in the fourth quarter of 2021 in 60V to 250V ranges. TOLT is currently available in 80V and 100V voltage classes. An evaluation power board including a 100V OptiMOS 5 power MOSFET in a TOLG package is also available (IPTG014N10M5).