Maxim MAX16602 & MAX20790 for Data Centers
Supports 60~800A designed products with over 95% efficiency
Provides high performance with 40% reduced output capacitance


Designers of massive data centers are grappling with how to address the increase in peak power and heat as demand for surging AI applications and deep learning grows.

On the 19th, Maxim Integrated released the 'MAX16602' AI Core Dual Output Voltage Regulator and the 'MAX20790' Smart Power Stage (SPS) IC to enable high-performance, high-output AI system designers to implement solutions that reduce power costs and heat generation.

AI systems implemented with the MAX16602 and MAX20790 multi-phase chipsets generate low heat. Current ripple reduction provided by Maxim's patented coupled inductors and monolithic integrated dual-side cooling power stage ICs reduce switching frequency by up to 50%, offering a 1% efficiency improvement over competing solutions.

This enables an efficiency of over 95% under conditions of 1.8V output voltage and 200A load, reducing wasted power by 16%. The monolithic integration method enables the achievement of high efficiency by eliminating parasitic resistance and inductance between the FET and the driver.

To enhance AI capabilities, space constraints must also be addressed. Maxim's low-profile coupled inductor technology supports higher saturation current per phase compared to discrete inductors in competing solutions, and by reducing the number of phases, it overcomes space constraints and reduces total maintenance costs. Output capacitance is also 40% lower than competing solutions, reducing the overall solution size and the number of capacitors.

Phase extensions from 2 to 16 are possible to meet various output current requirements, ranging from typical thermal design currents of 60A to over 800A. The low-profile coupled inductor, with a thickness of less than 4mm, is customizable and supports various form factors, such as PCIe and OCP accelerator modules. It supports AI edge computing as well as data center cloud computing.

Steven Chen, Director of Business Management for Maxim Integrated’s Cloud Data Center business unit, said, “Maxim’s multi-phase AI power chipset integrates power AI hardware accelerators such as GPUs, FPGAs, ASICs, and xPUs to increase solution efficiency and reduce size, making it compatible with various form factors such as PCIe and OAM.”