ACM Research, Inc., a leading provider of wafer processing solutions for semiconductor and advanced WLP (Wafer-Level Packaging) applications, is actively expanding its customer base by receiving an order for ECP demo equipment from a major IC manufacturer.


ACM Research announced on the 16th that it recently received an order for an evaluation unit of its Ultra ECP map copper plating equipment from a major IC manufacturer.

Delivery of the equipment is scheduled for early 2022, and the contract terms include relevant technical quality assurance and other commercial conditions.

Dr. David Wang, CEO and Representative Director of ACM Research, stated, "We are very pleased to have received an order for an evaluation unit of the Ultra ECP map equipment from another major semiconductor manufacturer based in Asia for advanced process development. This equipment order demonstrates ACM's technological leadership, our local support team, and our increasingly expanding production capacity. By successfully completing the evaluation of this equipment, we believe we can pursue more business and collaboration opportunities not only with this customer but also with other major customers in this region," he added.

Meanwhile, ACM's Ultra ECP map is based on electrochemical plating (ECP) technology that has already been validated in the industry. This equipment supports ACM's multi-anode partial copper plating function, enabling copper metal layer deposition over dual damascene structures at advanced technology nodes.

Additionally, this equipment is designed to minimize consumable costs and cost of ownership, ensure compatibility with ultra-thin seed layers, and achieve high throughput.