ST Microelectronics has unveiled the STA333IS, a single-chip digital audio system that delivers up to 2x20W audio output while measuring only 2.57mm x 3.24mm in size.

The STA333IS boasts the highest power density among single-chip digital audio systems currently available in the market. It combines state-of-the-art manufacturing processes and chip package miniaturization (CSP) technology with ST's proprietary digital audio IP such as FFX (full flexible amplification), and is included in ST's SoundTerminal™ product family.

ST is the only company with the technology to integrate advanced signal processing and power circuits on a single chip along with audio IP, making the newly launched STA333IS a particularly distinctive product in the market. The STA333IS operates across a wide voltage range from 4.5V to 18V, making it ideal not only for space-constrained applications such as LCD, LED TVs, docking stations, and digital wireless speaker systems, but also for battery-powered devices.

The STA333IS delivers excellent thermal efficiency, low electromagnetic emissions, and outstanding audio quality. With a footprint of only 8.33mm², it is well-suited for modern audio product designs.

The STA333SML has been launched alongside as a product for "micro-less" applications. This device requires no external microcontroller, enabling the development of digital amplifiers at minimal design cost.

The STA333IS and STA333SML are supplied as 5x6 bump 0.5mm pitch chip-scale package (CSP) devices, priced at $1 per unit based on 1,000-unit quantities.

For more information, visit http://www.st.com/sta333is.