Congatec Korea, a leader in embedded and edge computing technology, supports best-in-class designs by building an ecosystem that complies with PICMG standards.

Congatec announced on the 14th that it has released a COM-HPC carrier board design guide.

With the release of this guide, engineers can now immediately begin developing designs that meet standard specifications by selecting the appropriate computer-on-module, adding COM-HPC server or client evaluation carriers, and suitable cooling solutions.

In addition, it has become possible to install applications accordingly and proceed with programming, debugging, and testing processes in accordance with new high-performance embedded computing standards.

The Congatec COM-HPC ecosystem encompasses the entire scope of the new PICMG COM-HPC specifications, including COM-HPC module-based specifications, new carrier board design guidelines, embedded EEPROM specifications, and platform management interface specifications. This standard PICMG set, supported by leading embedded computing vendors including Congatec, provides engineers with best-in-class design security.

Christian Eder, Marketing Director at Congatec, said, “For edge servers and high-performance embedded clients, it is paramount to build an embedded computing platform that is interoperable, scalable, and customizable based on this powerful computer-on-module standard. The release of the COM-HPC Carrier Design Guide is the final component that engineers have been eagerly awaiting, and now everything is possible.” He added, “We have finally achieved the final milestone in PICMG’s essential standardization process, allowing us to start a design competition for best-in-class embedded and edge computing solutions.”