ACM Research, Inc., a leader in wafer handling solutions for semiconductor and advanced WLP (Wafer-Level Packaging) applications, has recorded its largest-ever order for wet bench equipment.

ACM announced on the 24th that it has secured orders for 29 Ultra C wb wet bench machines for 300mm wafer processes.

This order was secured from a Chinese customer, and 16 of the units are a reorder for the expansion of an existing customer's fab in China. These machines are scheduled to be delivered in two phases starting in 2022.

Dr. David Wang, Chairman and CEO of ACM Research, stated, “Our wet bench system was developed to meet the needs of customers who want to apply every possible wet cleaning technology across multiple nodes,” adding, “This large-scale order proves that our strategy to expand our product range beyond advanced cleaning equipment with competitive products was correct.”

Meanwhile, ACM Research introduced Ultra Low Pressure Drying (ULD) technology for 300 mm bench systems. This process is designed to mitigate post-cleaning drying issues associated with the high aspect ratio structures of 3D NAND and logic devices occurring in state-of-the-art semiconductor wafer processes.

ACM's new ULD bench module utilizes a low-pressure IPA (isopropyl alcohol) drying process to support processes such as pre-furnace cleaning, post-ion implantation cleaning, photoresist removal after dry etching, Chemical-Mechanical Planarization (CMP) cleaning, pre-film deposition cleaning, oxide etching, and nitride removal.

ACM shipped its first ULD module to a leading memory semiconductor manufacturer in China in the third quarter of 2021 and confirmed the effectiveness of the ULD module in advanced node manufacturing through initial process data derived from that customer.