ACM Research has succeeded in signing a large-scale supply contract for its high-speed electroplating equipment, 'Ultra ECP ap'.

ACM announced on the 17th that it recently signed a purchase agreement for 10 Ultra ECP ap high-speed electroplating machines with a major semiconductor back-end process (OSAT) customer in China.

The equipment is scheduled to be delivered to customers over this year and next year.

ACM’s Ultra ECP ap equipment, equipped with the latest high-speed plating technology, is being used in the advanced wafer-level packaging (WLP) processes of several OSAT customers.

ACM also achieved the feat of receiving an order for 10 Ultra ECP map machines from a leading Chinese foundry earlier this year.

These examples demonstrate that ACM's ECP technology is highly valued in the market.

Dr. David Wang, Founder and CEO of ACM, stated, “Market demand for high-performance chips is steadily increasing in various fields such as 5G, smartphones, the Internet of Things (IoT), and autonomous vehicles, and the demand for new WLP architectures to meet this is growing.“In this market environment, ACM’s ECP ap high-speed electroplating equipment has received multiple orders over the past year based on its stable performance. In particular, customers are expressing trust and satisfaction in ACM’s high-speed electroplating technology, such as by signing a contract to supply 10 units with a leading OSAT company in China, so we expect to secure a larger market share in the rapidly growing high-tech packaging market,” he said.