Infineon Technologies (Korea CEO Seungsoo Lee) has launched a next-generation microphone suitable for consumer devices with the highest precision and quality, narrowing the range of microphone choices for developers.

Infineon announced today the launch of its next-generation XENSIV™ MEMS microphones IM69D127, IM73A135 and IM72D128, which set new industry standards.

These MEMS microphones, which feature selectable power modes, are ideal for consumer devices such as headphones with active noise cancellation (ANC), TWS earbuds, conferencing equipment with beamforming capabilities, laptops, tablets, and smart speakers with voice control interfaces. They can also be used in industrial applications such as maintenance management and security.

These MEMS microphones are designed to receive audio signals with the highest precision and quality, and achieve high dust and water resistance (IP57) at the microphone level by applying Infineon's latest Sealed Dual Membrane (SDM) MEMS technology.

The sealed MEMS design prevents water or dust from penetrating between the membrane and backplate, eliminating the physical blockage or electrical leakage problems common in MEMS microphones. Additionally, by using microphones that utilize SDM technology, devices with the highest dust and water resistance rating of IP68 can be designed with minimal mesh application.

The analog microphone IM73A135 boasts a best-in-class signal-to-noise ratio (SNR) of 73 dB(A) and an outstanding acoustic overload point (AOP) of 135 dB SPL.

The digital microphone IM72D128 has a signal-to-noise ratio (SNR) of 72dB(A) and an AOP of 128dB SPL, while the IM69D127 offers similar performance in a very small 3.60mm x 2.50mm package.

Additionally, the device exhibits extremely low total harmonic distortion (THD) even at high sound pressure levels. Components feature uniform phase and sensitivity matching, a flat frequency response with low FRO (low-frequency roll-off), very low group delay, and selectable power modes.