Intel Lab has made the greatest progress in multi-wavelength integrated photonics research, raising expectations for the production of light sources with the performance required for future high-volume applications such as co-packaged optics (CPO) and optical computing interconnects.

Intel Labs announced on the 30th that it has made significant progress in the field of integrated photonics research, which increases communication bandwidth between computing silicon across data centers and networks.

The results of this study are characterized by achieving the industry's best advancement in the field of multi-wavelength integrated photonics.

In addition, an 8-wavelength distributed feedback (DFB) laser array was demonstrated, providing excellent output uniformity of +/-0.25 decibels (dB) and ±6.5% wavelength spacing uniformity, exceeding industry standards.

“This research demonstrates that it is possible to obtain suitable output power with uniform and dense wavelengths,” said Haiseng Rong, a senior engineer at Intel Labs. “Most importantly, it has paved a clear path for the mass production of next-generation co-packaged photonics and optical computing interconnects using existing manufacturing and process controls at Intel fabs.”

These results include new artificial intelligence and machine learningIt enables the production of light sources with the performance required for future high-volume applications, such as co-packaged optics (CPO) and optical computing interconnects for network-intensive workloads.

The laser array is built on Intel's 300 mm silicon optical manufacturing process, laying the foundation for mass manufacturing and widespread applications.

This announcement ensures consistent wavelength separation of light sources while maintaining uniform output power, meeting one of the requirements for optical computing interconnects and DWDM communication. This enables the fabrication of next-generation computing I/O using optical interconnects to meet the surging demand for high-bandwidth artificial intelligence and machine learning workloads in the future.

The 8-wavelength dispersed feedback array was designed and fabricated based on Intel's commercial 300mm hybrid silicon optical platform, which is used to manufacture high-volume optical transceivers. By utilizing the same lithography technology used to manufacture 300mm silicon wafers with strict process control, it has significantly enhanced laser manufacturing capabilities in high-volume complementary metal oxide semiconductor (CMOS) fabs.

For this study, Intel used lithography technology to define waveguide gratings in silicon prior to the III-V wafer bonding process. This technology demonstrated more uniform wavelengths compared to conventional semiconductor lasers manufactured in 3-inch or 4-inch III-V wafer fabs.

In addition, the laser array can maintain a constant channel spacing even with changes in ambient temperature based on the close integration between lasers.

As a pioneer in silicon optics technology, Intel is committed to developing more efficient solutions to meet the growing demand for resource-rich network infrastructure. Intel is developing key technology components such as light generation, amplification, detection, modulation, CMOS interface circuits, and package integration technology.

In addition, Intel’s Silicon Photonics Products Division is utilizing 8-wavelength integrated laser array technology in various ways for future optical computing interconnect chiplet products.

Future products will provide high power efficiency and high-performance multi-terabit interconnectivity between computing resources such as CPUs, GPUs, and memory. Integrated laser arrays are a critical element in providing compact and cost-effective solutions that support high-volume manufacturing and deployment.