▲ Infineon CIPOS™ Mini (Photo courtesy of Infineon Korea)


Infineon Launches IM523 Series of CIPOS™ Mini Product Family
Integration of power devices and control components… Optimization of system costs

Infineon Technologies (hereinafter Infineon) has unveiled a product series that achieves best-in-class switching losses and increases energy efficiency for applications operating at high switching frequencies.

Infineon Technologies announced on the 31st that it is launching the IM523 series of the CIPOS™ Mini product family.

A high-efficiency IPM (intelligent power module) based on the new 600V RCD2 (Reverse Conducting Drive 2) IGBT technology is provided in an open emitter configuration.

The CIPOS IM523 series integrates various power devices and control components to enhance system reliability and optimize PCB size and system costs.

The new IPM is designed for the control of three-phase motors for medium-to-low power variable speed drives in home appliances and HVAC (heating, ventilation, air conditioning), and industrial fans and drives up to 1.4kW.

Combines RCD2 IGBTs with comprehensive SOI (silicon-on-insulator) gate drivers to reduce system power consumption.

3-phase with open emitter The inverter configuration is integrated into a DIP 36x21 package, which is particularly suitable for power applications requiring excellent thermal conductivity and electrical insulation.

In addition, this series achieves best-in-class switching losses, increasing energy efficiency for applications operating at high switching frequencies.

These devices are available with a rating of 6A to 17A and 600V.

Temperature monitoring using UL-certified NTC thermistors, undervoltage lockout (UVLO) and overcurrent protection (OCP) functions for all channels provide enhanced system reliability, and a package with excellent resistance to moisture is used.

Infineon stated, “This IPM can simplify PCB layout by integrating bootstrap circuitry,” adding, “Since it is an industry-standard package, existing designs using Mini IPM (P2P) can be easily and quickly replaced without the need to change the PCB, thereby shortening time-to-market.”