January 20, 2014, Seoul — STMicroelectronics (ST), a global semiconductor company contributing to customers across a wide range of electronic applications, announced Teseo III, a single-chip standalone positioning family. Teseo III is capable of receiving signals from multiple satellite navigation systems, including China's proprietary BeiDou, the U.S. GPS, Europe's Galileo, Russia's GLONASS, and Japan's QZSS.

The new Teseo III family is built upon the industry-leading performance of Teseo II single-chip satellite tracking ICs, enabling it to provide a new level of cutting-edge accuracy in position tracking. Furthermore, leveraging ST’s support and investment in sensor fusion technology, it has been applied to Automotive Dead Reckoning (ADR) and Assisted-Global Navigation Satellite System (A-GNSS) functions.

"Teseo III adds China's BeiDou satellite tracking to the entire global system, providing even greater accuracy and positional precision across Asia and the rest of the world," said Antonio Radaelli, Senior Vice President of ST Infotainment Business Unit. "Teseo III utilizes the best signals from all systems to provide exceptional accuracy in urban, rural, and mountainous areas across a wide range of devices, including in-vehicle navigation, telematics systems, mobile, marine, and fitness."

The Teseo III product family is available in two series.
The STA8089 series adds BeiDou satellite support and is pin-to-pin compatible with the Teseo II series, allowing for rapid deployment in customer applications.
- The STA8090 series features support for China's BeiDou satellite and a new, more powerful power management unit.

The Teseo III family is a single-chip solution with integrated RF, digital control circuitry, and flash memory that can track multiple satellites simultaneously regardless of the satellite constellation. It also offers excellent accuracy even in conditions where satellite visibility is reduced due to dense high-rise buildings and other obstacles. Like other products in the Teseo family, the Teseo III combines high positioning accuracy, indoor sensitivity performance with powerful processing capabilities, and outstanding design flexibility.

Theseo III is in the final verification stage and sampling will be available in the first quarter of 2014.