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Focus on initial 6in supply, support for 8in later
Infineon Technologies has strengthened its supply of silicon carbide (SiC) materials and cooperation with related suppliers through long-term contracts.
Infineon announced on the 12th that it recently signed a long-term contract with Japan's Resonac Corporation (formerly Showa Denko KK) for the supply of SiC materials.
According to the announcement, Resonac will supply SiC materials to Infineon for future SiC semiconductor production, accounting for a double-digit share of expected demand over the next 10 years.
The initial phase will focus on supplying 6-inch SiC material, but in the second half of the contract, the company plans to also support Infineon's transition to 8-inch wafer diameter.
As part of the collaboration, Infineon will reportedly provide Resonac with intellectual property related to SiC material technology.
Infineon is expanding its manufacturing capacity to secure more than 30% market share in the SiC market within ten years, and plans to secure manufacturing capacity tenfold by 2027.
In this regard, a new plant in Kulim, Malaysia, is scheduled to begin production in 2024.
Currently, Infineon supplies SiC semiconductors to more than 3,600 customers worldwide.
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