ST's RF IPD supports application-level processing and wireless communication functions
Integration of components into a single die prevents process variations and guarantees consistent performance

STMicroelectronics (hereinafter ST) announced on the 2nd that it has released nine types of RF IPDs (Integrated Passive Devices) that integrate antenna impedance matching, baluns, and harmonic filter circuits optimized for STM32WL wireless MCUs.

ST's STM32WL MCU integrates an Arm® Cortex®-M4 MCU and a Cortex-M0+ core for sub-GHz long-range wireless management to support both application-level processing and wireless communication functions for smart connected devices.

Wireless is compatible with LPWAN and supports multiple modulation schemes, including LoRaWAN® and Sigfox™ included in the STM32CubeWL MCU software package.

RF IPDs, which are ultra-small chip-scale package devices, help maximize RF performance by connecting STM32WL MCUs to antennas.

By integrating all components into a single die, it prevents process variations affecting existing matching networks implemented with individual parts and ensures consistent performance.

In addition, it simplifies circuit design, reduces Bill of Materials (BoM), and enables miniaturization, making it highly suitable for cost-sensitive and space-constrained IoT devices.do.

Designers can use nine types of RF IPD models to select optimal parameters based on RF frequency range and power, MCU package type, and 2-layer or 4-layer PCB.

This series consists of BALFHB-WL-01D3 to BALFHB-WL-06D3, which support 868MHz and 915MHz applications, as well as BALFLB-WL-07D3, BALFLB-WL-08D3, and BALFLB-WL-09D3, which are optimized for 490MHz.

Each device integrates a complete receiving and transmitting signal path between the MCU and the antenna.

The integrated filter provides high attenuation for unwanted transmitter harmonics, enabling designers to meet regulations set by wireless licensing authorities worldwide.

All devices are currently in production and are provided as 2.13mm x 1.83mm 8-bump WLCSP (Wafer-Level Chip-Scale Package) with a reflow profile of only 630µm.